Nom de code de l’architecture |
Whiskey Lake |
Coffee Lake |
Date de sortie |
Q2'19 |
23 April 2019 |
Prix de sortie (MSRP) |
$409 |
$250 |
Position dans l’évaluation de la performance |
1554 |
1547 |
Processor Number |
i7-8665UE |
i5-9300H |
Série |
8th Generation Intel Core i7 Processors |
|
Status |
Launched |
Launched |
Segment vertical |
Embedded |
Mobile |
Soutien de 64-bit |
|
|
Base frequency |
1.70 GHz |
2.40 GHz |
Cache L1 |
256 KB |
256 KB |
Cache L2 |
1 MB |
1 MB |
Cache L3 |
8 MB |
8 MB |
Processus de fabrication |
14 nm |
14 nm |
Température de noyau maximale |
100 °C |
100 °C |
Fréquence maximale |
4.40 GHz |
4.10 GHz |
Nombre de noyaux |
4 |
4 |
Nombre de fils |
8 |
8 |
Bus Speed |
|
8 GT/s DMI |
Réseaux de mémoire maximale |
2 |
2 |
Bande passante de mémoire maximale |
37.5 GB/s |
41.8 GB/s |
Taille de mémore maximale |
64 GB |
128 GB |
Genres de mémoire soutenus |
DDR4-2400, LPDDR3-2133 |
DDR4-2666, LPDDR3-2133 |
Soutien de la mémoire ECC |
|
|
Unités d’éxécution |
24 |
|
Graphics base frequency |
300 MHz |
350 MHz |
Graphics max dynamic frequency |
1.15 GHz |
1.05 GHz |
Intel® Quick Sync Video |
|
|
Graphiques du processeur |
Intel UHD Graphics 620 |
Intel UHD Graphics 630 |
Device ID |
|
0x3E9B |
Technologie Intel® Clear Video HD |
|
|
Technologie Intel® Clear Video |
|
|
Technologie Intel® InTru™ 3D |
|
|
Mémoire de vidéo maximale |
|
64 GB |
DisplayPort |
|
|
eDP |
|
|
HDMI |
|
|
Nombre d’écrans soutenu |
3 |
3 |
DVI |
|
|
Soutien de la resolution 4K |
|
|
Résolution maximale sur DisplayPort |
4096x2304@60Hz |
4096x2304@60Hz |
Résolution maximale sur eDP |
4096x2304@60Hz |
4096x2304@60Hz |
Résolution maximale sur HDMI 1.4 |
4096x2160@30/24Hz |
4096x2304@30Hz |
DirectX |
12 |
12 |
OpenGL |
4.5 |
4.5 |
Configurable TDP-down |
12.5 Watt |
35 Watt |
Configurable TDP-down Frequency |
1.30 GHz |
|
Configurable TDP-up |
25 Watt |
|
Configurable TDP-up Frequency |
2.00 GHz |
|
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Package Size |
46 x 24 |
|
Prise courants soutenu |
FCBGA1528 |
FCBGA1440 |
Thermal Design Power (TDP) |
15 Watt |
45 Watt |
Nombre maximale des voies PCIe |
16 |
16 |
Révision PCI Express |
3.0 |
3.0 |
PCIe configurations |
1x4, 2x2, 1x2+2x1 and 4x1 |
1x16, 2x8, 1x8+2x4 |
Execute Disable Bit (EDB) |
|
|
Intel® OS Guard |
|
|
Technologie Intel® Secure Key |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Technologie Intel® Identity Protection |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel SSE4.1 |
|
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® Optane™ Memory Supported |
|
|
Intel® TSX-NI |
|
|
Technologie Intel® Turbo Boost |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Thermal Monitoring |
|
|
Intel® Advanced Vector Extensions 2 (AVX2) |
|
|
Intel® Flex Memory Access |
|
|
Technologie Intel® My WiFi |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® Thermal Velocity Boost |
|
|
Speed Shift technology |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|