Nom de code de l’architecture |
Skylake |
Sandy Bridge |
Date de sortie |
Q1'18 |
April 2011 |
Position dans l’évaluation de la performance |
1417 |
1411 |
Processor Number |
D-2143IT |
E3-1275 |
Série |
Intel® Xeon® D Processor |
Intel® Xeon® Processor E3 Family |
Status |
Launched |
Discontinued |
Segment vertical |
Server |
Server |
Prix de sortie (MSRP) |
|
$450 |
Prix maintenant |
|
$304 |
Valeur pour le prix (0-100) |
|
8.09 |
Soutien de 64-bit |
|
|
Base frequency |
2.20 GHz |
3.40 GHz |
Processus de fabrication |
14 nm |
32 nm |
Fréquence maximale |
3.00 GHz |
3.80 GHz |
Nombre de noyaux |
8 |
4 |
Nombre de fils |
16 |
8 |
Number of Ultra Path Interconnect (UPI) Links |
0 |
|
Bus Speed |
|
5 GT/s DMI |
Taille de dé |
|
216 mm |
Cache L1 |
|
64 KB (per core) |
Cache L2 |
|
256 KB (per core) |
Cache L3 |
|
8192 KB (shared) |
Température de noyau maximale |
|
72.6°C |
Compte de transistor |
|
1160 million |
Réseaux de mémoire maximale |
4 |
2 |
Taille de mémore maximale |
512 GB |
32 GB |
Supported memory frequency |
2133 MHz |
|
Genres de mémoire soutenus |
DDR4 |
DDR3 1066/1333 |
Soutien de la mémoire ECC |
|
|
Bande passante de mémoire maximale |
|
21 GB/s |
Low Halogen Options Available |
|
|
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Prise courants soutenu |
FCBGA2518 |
LGA1155 |
Thermal Design Power (TDP) |
65 Watt |
95 Watt |
Package Size |
|
37.5mm x 37.5mm |
Nombre maximale des voies PCIe |
32 |
20 |
Révision PCI Express |
3.0 |
2.0 |
PCIe configurations |
> |
|
Scalability |
1S Only |
|
Execute Disable Bit (EDB) |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Intel® OS Guard |
|
|
Technologie Intel® Secure Key |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Secure Boot |
|
|
Technologie Intel® Identity Protection |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel® AVX2 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX |
Integrated Intel® QuickAssist Technology |
|
|
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® Optane™ Memory Supported |
|
|
Intel® TSX-NI |
|
|
Technologie Intel® Turbo Boost |
|
|
Intel® Volume Management Device (VMD) |
|
|
Number of AVX-512 FMA Units |
1 |
|
Thermal Monitoring |
|
|
Flexible Display interface (FDI) |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Intel® Demand Based Switching |
|
|
Intel® Fast Memory Access |
|
|
Intel® Flex Memory Access |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|
Graphics base frequency |
|
850 MHz |
Graphics max dynamic frequency |
|
1.35 GHz |
Freéquency maximale des graphiques |
|
1.35 GHz |
Technologie Intel® Clear Video HD |
|
|
Intel® Flexible Display Interface (Intel® FDI) |
|
|
Technologie Intel® InTru™ 3D |
|
|
Intel® Quick Sync Video |
|
|
Graphiques du processeur |
|
Intel HD Graphics P3000 |
Nombre d’écrans soutenu |
|
2 |
Soutien du Wireless Display (WiDi) |
|
|