Nom de code de l’architecture |
Ivy Bridge EP |
Haswell |
Date de sortie |
Q3'13 |
June 2013 |
Position dans l’évaluation de la performance |
1579 |
1573 |
Processor Number |
E5-2648LV2 |
i5-4570TE |
Série |
Intel® Xeon® Processor E5 v2 Family |
4th Generation Intel® Core™ i5 Processors |
Status |
Launched |
Launched |
Segment vertical |
Embedded |
Embedded |
Prix de sortie (MSRP) |
|
$239 |
Prix maintenant |
|
$198.99 |
Valeur pour le prix (0-100) |
|
5.67 |
Soutien de 64-bit |
|
|
Base frequency |
1.90 GHz |
2.70 GHz |
Bus Speed |
8 GT/s QPI |
5 GT/s DMI |
Processus de fabrication |
22 nm |
22 nm |
Température de noyau maximale |
92°C |
66.35°C |
Fréquence maximale |
2.50 GHz |
3.30 GHz |
Nombre de noyaux |
10 |
2 |
Number of QPI Links |
2 |
|
Nombre de fils |
20 |
4 |
Rangée de tension VID |
0.65–1.30V |
|
Taille de dé |
|
177 mm |
Cache L1 |
|
64 KB (per core) |
Cache L2 |
|
256 KB (per core) |
Cache L3 |
|
4096 KB (shared) |
Température maximale de la caisse (TCase) |
|
72 °C |
Compte de transistor |
|
1400 million |
Réseaux de mémoire maximale |
4 |
2 |
Bande passante de mémoire maximale |
59.7 GB/s |
25.6 GB/s |
Taille de mémore maximale |
768 GB |
32 GB |
Genres de mémoire soutenus |
DDR3 800/1066/1333/1600/1866 |
DDR3 1333/1600 |
Soutien de la mémoire ECC |
|
|
Low Halogen Options Available |
|
|
Nombre de CPUs maximale dans une configuration |
2 |
1 |
Package Size |
52.5mm x 45mm |
37.5mm x 37.5mm (LGA 1150) |
Prise courants soutenu |
FCLGA2011 |
FCLGA1150 |
Thermal Design Power (TDP) |
70 Watt |
35 Watt |
Thermal Solution |
|
PCG 2013A |
Nombre maximale des voies PCIe |
40 |
16 |
Révision PCI Express |
3.0 |
3.0 |
PCIe configurations |
x4, x8, x16 |
Up to 1x16, 2x8, 1x8 2x4 |
Scalability |
2S Only |
1S Only |
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Identity Protection |
|
|
Intel® OS Guard |
|
|
Technologie Intel® Secure Key |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Technologie Anti-Theft |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel® AVX |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Intel® Demand Based Switching |
|
|
Intel® Flex Memory Access |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® TSX-NI |
|
|
Technologie Intel® Turbo Boost |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Physical Address Extensions (PAE) |
46-bit |
|
Thermal Monitoring |
|
|
Flexible Display interface (FDI) |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Technologie Intel® My WiFi |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|
Graphics base frequency |
|
350 MHz |
Graphics max dynamic frequency |
|
1.00 GHz |
Freéquency maximale des graphiques |
|
1 GHz |
Technologie Intel® Clear Video HD |
|
|
Intel® Flexible Display Interface (Intel® FDI) |
|
|
Technologie Intel® InTru™ 3D |
|
|
Intel® Quick Sync Video |
|
|
Mémoire de vidéo maximale |
|
1.7 GB |
Graphiques du processeur |
|
Intel® HD Graphics 4600 |
Nombre d’écrans soutenu |
|
3 |
Soutien du Wireless Display (WiDi) |
|
|