Nom de code de l’architecture |
Comet Lake |
Coffee Lake |
Date de sortie |
13 may 2020 |
27 May 2019 |
Prix de sortie (MSRP) |
$367 |
$623 |
Position dans l’évaluation de la performance |
741 |
749 |
Processor Number |
W-1270TE |
E-2286M |
Série |
Intel Xeon W Processor |
E-2200 |
Status |
Launched |
|
Segment vertical |
Embedded |
Mobile |
Family |
|
Xeon E |
Soutien de 64-bit |
|
|
Base frequency |
2.00 GHz |
2.40 GHz |
Bus Speed |
8 GT/s |
8 GT/s DMI |
Cache L1 |
512 KB |
512 KB |
Cache L2 |
2 MB |
2 MB |
Cache L3 |
16 MB |
16 MB |
Processus de fabrication |
14 nm |
14 nm |
Température de noyau maximale |
100°C |
100 °C |
Fréquence maximale |
4.40 GHz |
5.00 GHz |
Nombre de noyaux |
|
8 |
Nombre de fils |
|
16 |
Ouvert |
|
|
Réseaux de mémoire maximale |
2 |
2 |
Bande passante de mémoire maximale |
45.8 GB/s |
41.8 GB/s |
Taille de mémore maximale |
128 GB |
128 GB |
Genres de mémoire soutenus |
DDR4-2933 |
DDR4-2666, LPDDR3-2133 |
Soutien de la mémoire ECC |
|
|
Device ID |
0x9BC6 |
0x3E94 |
Graphics base frequency |
350 MHz |
350 MHz |
Graphics max dynamic frequency |
1.15 GHz |
1.25 GHz |
Technologie Intel® Clear Video HD |
|
|
Technologie Intel® Clear Video |
|
|
Technologie Intel® InTru™ 3D |
|
|
Intel® Quick Sync Video |
|
|
Mémoire de vidéo maximale |
64 GB |
64 GB |
Graphiques du processeur |
Intel UHD Graphics 630 |
Intel UHD Graphics P630 |
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Nombre d’écrans soutenu |
3 |
3 |
Soutien de la resolution 4K |
|
|
Résolution maximale sur DisplayPort |
4096x2304@60Hz |
4096x2304@60Hz |
Résolution maximale sur eDP |
4096x2304@60Hz |
4096x2304@60Hz |
Résolution maximale sur HDMI 1.4 |
|
4096x2304@30Hz |
DirectX |
12 |
12 |
OpenGL |
4.5 |
4.5 |
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Package Size |
37.5mm x 37.5mm |
|
Prise courants soutenu |
FCLGA1200 |
FCBGA1440 |
Thermal Design Power (TDP) |
35 Watt |
45 Watt |
Thermal Solution |
PCG 2015B |
|
Configurable TDP-down |
|
35 Watt |
Nombre maximale des voies PCIe |
16 |
16 |
Révision PCI Express |
3.0 |
3.0 |
PCIe configurations |
Up to 1x16, 2x8, 1x8+2x4 |
1x16, 2x8, 1x8+2x4 |
Scalability |
1S Only |
|
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Identity Protection |
|
|
Intel® OS Guard |
|
|
Technologie Intel® Secure Key |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Secure Boot |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel SSE4.1, Intel SSE4.2, Intel AVX2 |
Intel SSE4.1, Intel SSE4.2, Intel AVX2 |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Technologie Intel® Hyper-Threading |
|
|
Technologie Intel® Turbo Boost |
|
|
Thermal Monitoring |
|
|
Intel® Advanced Vector Extensions 2 (AVX2) |
|
|
Intel® Flex Memory Access |
|
|
Technologie Intel® My WiFi |
|
|
Intel® Optane™ Memory Supported |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® Thermal Velocity Boost |
|
|
Intel® TSX-NI |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Speed Shift technology |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|