| Architektur Codename |
Amber Lake Y |
Skylake |
| Startdatum |
21 Aug 2019 |
Q1'16 |
| Einführungspreis (MSRP) |
$403 |
|
| Platz in der Leistungsbewertung |
1707 |
1723 |
| Prozessornummer |
i7-10510Y |
G3900E |
| Serie |
10th Generation Intel Core i7 Processors |
Intel® Celeron® Processor G Series |
| Status |
Launched |
Launched |
| Vertikales Segment |
Mobile |
Embedded |
| 64-Bit-Unterstützung |
|
|
| Basistaktfrequenz |
1.20 GHz |
2.40 GHz |
| Bus Speed |
4 GT/s |
8 GT/s DMI3 |
| L1 Cache |
256 KB |
|
| L2 Cache |
1 MB |
|
| L3 Cache |
8 MB |
|
| Fertigungsprozesstechnik |
14 nm |
14 nm |
| Maximale Kerntemperatur |
100 |
100°C |
| Maximale Frequenz |
4.50 GHz |
|
| Anzahl der Adern |
4 |
2 |
| Anzahl der Gewinde |
8 |
2 |
| Maximale Speicherkanäle |
2 |
2 |
| Maximale Speicherbandbreite |
33.33 GB/s |
34.1 GB/s |
| Maximale Speichergröße |
16 GB |
64 GB |
| Unterstützte Speichertypen |
LPDDR3-2133, DDR3L-1600 |
DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V |
| Device ID |
0x87CA |
0x1902 |
| Ausführungseinheiten |
24 |
|
| Graphics base frequency |
300 MHz |
350 MHz |
| Graphics max dynamic frequency |
1.15 GHz |
950 MHz |
| Intel® Clear Video HD Technologie |
|
|
| Intel® Clear Video Technologie |
|
|
| Intel® Quick Sync Video |
|
|
| Maximaler Videospeicher |
16 GB |
64 GB |
| Prozessorgrafiken |
Intel UHD Graphics |
Intel® HD Graphics 510 |
| Intel® InTru™ 3D-Technologie |
|
|
| DisplayPort |
|
|
| DVI |
|
|
| eDP |
|
|
| HDMI |
|
|
| Anzahl der unterstützten Anzeigen |
3 |
3 |
| Unterstützung von 4K-Auflösungen |
|
|
| Maximale Auflösung über DisplayPort |
3840x2160@60Hz |
4096x2304@60Hz |
| Maximale Auflösung über eDP |
3840x2160@60Hz |
4096x2304@60Hz |
| Maximale Auflösung über HDMI 1.4 |
4096x2304@24Hz |
4096x2304@24Hz |
| DirectX |
12 |
12 |
| OpenGL |
4.5 |
4.4 |
| Configurable TDP-down |
4.5 Watt |
|
| Configurable TDP-down Frequency |
400 MHz |
|
| Configurable TDP-up |
9 Watt |
|
| Configurable TDP-up Frequency |
1.50 GHz |
|
| Maximale Anzahl von CPUs in einer Konfiguration |
1 |
1 |
| Gehäusegröße |
26.5mm x 18.5mm |
42mm x 28mm |
| Unterstützte Sockel |
UTFCBGA1377 |
FCBGA1440 |
| Thermische Designleistung (TDP) |
7 Watt |
35 Watt |
| Low Halogen Options Available |
|
|
| Maximale Anzahl von PCIe-Strecken |
10 |
16 |
| PCI Express Revision |
3.0 |
3.0 |
| PCIe configurations |
1x4, 2x2, 1x2+2x1 and 4x1 |
Up to 1x16, 2x8, 1x8+2x4 |
| Skalierbarkeit |
|
1S Only |
| Execute Disable Bit (EDB) |
|
|
| Intel® Identity Protection Technologie |
|
|
| Intel® Memory Protection Extensions (Intel® MPX) |
|
|
| Intel® OS Guard |
|
|
| Intel® Secure Key Technologie |
|
|
| Intel® Software Guard Extensions (Intel® SGX) |
|
|
| Intel® Trusted Execution Technologie (TXT) |
|
|
| Secure Boot |
|
|
| Enhanced Intel SpeedStep® Technologie |
|
|
| Idle States |
|
|
| Befehlssatzerweiterungen |
Intel SSE4.1 |
Intel® SSE4.1, Intel® SSE4.2 |
| Intel 64 |
|
|
| Intel® AES New Instructions |
|
|
| Intel® Flex Memory Access |
|
|
| Intel® Hyper-Threading Technologie |
|
|
| Intel® My WiFi Technologie |
|
|
| Intel® Stable Image Platform Program (SIPP) |
|
|
| Intel® Thermal Velocity Boost |
|
|
| Intel® Turbo Boost Technologie |
|
|
| Speed-Shift-Technologie |
|
|
| Thermal Monitoring |
|
|
| Intel® TSX-NI |
|
|
| Intel® vPro™ Plattform-Berechtigung |
|
|
| Intel® Virtualization Technology (VT-x) |
|
|
| Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
| Intel® VT-x with Extended Page Tables (EPT) |
|
|