Architektur Codename |
Kaby Lake G |
Broadwell |
Startdatum |
10 January 2018 |
2 June 2015 |
Platz in der Leistungsbewertung |
1055 |
1052 |
Processor Number |
i7-8709G |
i7-5950HQ |
Serie |
8th Generation Intel® Core™ i7 Processors |
5th Generation Intel® Core™ i7 Processors |
Status |
Announced |
Launched |
Vertikales Segment |
Mobile |
Mobile |
Einführungspreis (MSRP) |
|
$623 |
64-Bit-Unterstützung |
|
|
Base frequency |
3.10 GHz |
2.90 GHz |
Bus Speed |
8 GT/s DMI |
5 GT/s DMI2 |
L1 Cache |
256 KB |
256 KB |
L2 Cache |
1 MB |
1 MB |
L3 Cache |
8 MB |
6 MB |
Fertigungsprozesstechnik |
14 nm |
14 nm |
Maximale Gehäusetemperatur (TCase) |
72 °C |
|
Maximale Kerntemperatur |
100°C |
105°C |
Maximale Frequenz |
4.10 GHz |
3.80 GHz |
Anzahl der Adern |
4 |
4 |
Anzahl der Gewinde |
8 |
8 |
Maximale Speicherkanäle |
2 |
2 |
Maximale Speicherbandbreite |
37.5 GB/s |
25.6 GB/s |
Maximale Speichergröße |
64 GB |
32 GB |
Unterstützte Speichertypen |
DDR4-2400 |
DDR3L 1600/1866 LPDDR3 1600/1866 |
Graphics base frequency |
350 MHz |
300 MHz |
Graphics max dynamic frequency |
1.10 GHz |
1.15 GHz |
Intel® Clear Video HD Technologie |
|
|
Intel® Clear Video Technologie |
|
|
Intel® InTru™ 3D-Technologie |
|
|
Intel® Quick Sync Video |
|
|
Maximaler Videospeicher |
64 GB |
32 GB |
Prozessorgrafiken |
Intel® HD Graphics 630 |
Intel® Iris® Pro Graphics 6200 |
Device ID |
|
0x1622 |
Grafik Maximalfrequenz |
|
1.15 GHz |
Intel® Flexible Display Interface (Intel® FDI) |
|
|
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Anzahl der unterstützten Anzeigen |
3 |
3 |
VGA |
|
|
Unterstützung für Wireless Display (WiDi) |
|
|
Unterstützung von 4K-Auflösungen |
|
|
Maximale Auflösung über DisplayPort |
4096 x 2160 @60Hz |
4096x2304@60Hz |
Maximale Auflösung über eDP |
4096 x 2160 @60Hz |
|
Maximale Auflösung über HDMI 1.4 |
4096 x 2160 @30Hz |
2560x1600@60Hz |
DirectX |
12 |
11.2/12 |
OpenGL |
4.4 |
4.3 |
Low Halogen Options Available |
|
|
Maximale Anzahl von CPUs in einer Konfiguration |
1 |
|
Package Size |
31mm x 58.5mm |
37.5mm x 32mm x 1.8mm |
Unterstützte Sockel |
BGA2270 |
FCBGA1364 |
Thermische Designleistung (TDP) |
100 Watt |
47 Watt |
Maximale Anzahl von PCIe-Strecken |
8 |
16 |
PCI Express Revision |
3.0 |
3.0 |
PCIe configurations |
Up to 1x8, 2x4 |
1x16 or 2x8 or 1x8 2x4 |
Execute Disable Bit (EDB) |
|
|
Intel® Identity Protection Technologie |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Intel® OS Guard |
|
|
Intel® Secure Key Technologie |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Intel® Trusted Execution Technologie (TXT) |
|
|
Enhanced Intel SpeedStep® Technologie |
|
|
Idle States |
|
|
Befehlssatzerweiterungen |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Intel® AES New Instructions |
|
|
Intel® Flex Memory Access |
|
|
Intel® Hyper-Threading Technologie |
|
|
Intel® My WiFi Technologie |
|
|
Intel® Smart Response Technologie |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® TSX-NI |
|
|
Intel® Turbo Boost Technologie |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Speed Shift technology |
|
|
Thermal Monitoring |
|
|
Flexible Display interface (FDI) |
|
|
Intel® Fast Memory Access |
|
|
AMD Virtualization (AMD-V™) |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|