AMD Ryzen 3 3300U processor review

AMD Ryzen 3 3300U

Ryzen 3 3300U processor released by AMD; release date: 6 Jan 2019. The processor is designed for laptop-computers and based on Zen+ microarchitecture.

CPU is unlocked for overclocking. Total number of cores - 4, threads - 4. Maximum CPU clock speed - 3.5 GHz. Maximum operating temperature - 105°C. Manufacturing process technology - 12 nm. Cache size: L1 - 384 KB, L2 - 2 MB, L3 - 4 MB.

Supported memory types: DDR4-2400. Maximum memory size: 64 GB.

Supported socket types: FP5. Power consumption (TDP): 15 Watt.

The processor has integrated graphics Radeon Vega 6 Graphics with the following parameters: maximum frequency - 1200 MHz, cores count - 6.

Benchmarks

PassMark
Single thread mark
Top 1 CPU
This CPU
4870
1837
PassMark
CPU mark
Top 1 CPU
This CPU
156834
5673
Name Value
PassMark - Single thread mark 1837
PassMark - CPU mark 5673

Integrated graphics – AMD Radeon Vega 6 Mobile

Technical info

Boost clock speed 1011 MHz
Core clock speed 300 MHz
Manufacturing process technology 14 nm
Thermal Design Power (TDP) 15 Watt
Transistor count 4,940 million

Specifications (specs)

Essentials

Architecture codename Zen+
Family AMD Ryzen Processors
Launch date 6 Jan 2019
OPN Tray YM3300C4T4MFG
Place in performance rating 1352
Series AMD Ryzen 3 Mobile Processors with Radeon Vega Graphics
Vertical segment Laptop

Performance

Base frequency 2.1 GHz
Compute Cores 10
L1 cache 384 KB
L2 cache 2 MB
L3 cache 4 MB
Manufacturing process technology 12 nm
Maximum core temperature 105°C
Maximum frequency 3.5 GHz
Number of cores 4
Number of GPU cores 6
Number of threads 4
Unlocked

Memory

ECC memory support
Max memory channels 2
Maximum memory bandwidth 35.76 GB/s
Maximum memory size 64 GB
Supported memory frequency 2400 MHz
Supported memory types DDR4-2400

Graphics

Graphics max frequency 1200 MHz
iGPU core count 6
Processor graphics Radeon Vega 6 Graphics

Graphics interfaces

DisplayPort
HDMI

Graphics API support

DirectX 12

Compatibility

Configurable TDP-down 12 Watt
Configurable TDP-up 35 Watt
Sockets supported FP5
Thermal Design Power (TDP) 15 Watt

Advanced Technologies

AMD SenseMI
FreeSync
The "Zen" Core Architecture