Intel Celeron 887 processor review

Intel Celeron 887

Celeron 887 processor released by Intel; release date: 1 October 2012. At the time of release, the processor cost $86. The processor is designed for mobile-computers and based on Sandy Bridge microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 1.5 GHz. Maximum operating temperature - 100 °C. Manufacturing process technology - 32 nm. Cache size: L1 - 128 KB, L2 - 512 KB, L3 - 2048 KB.

Supported memory types: DDR3 1066/1333. Maximum memory size: 16 GB.

Supported socket types: FCBGA1023. Maximum number of processors in a configuration - 1. Power consumption (TDP): 17 Watt.

The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 1 GHz.

Benchmarks

PassMark
Single thread mark
Top 1 CPU
This CPU
4870
703
PassMark
CPU mark
Top 1 CPU
This CPU
156834
754
Geekbench 4
Single Core
Top 1 CPU
This CPU
5311
224
Geekbench 4
Multi-Core
Top 1 CPU
This CPU
36691
410
Name Value
PassMark - Single thread mark 703
PassMark - CPU mark 754
Geekbench 4 - Single Core 224
Geekbench 4 - Multi-Core 410

Specifications (specs)

Essentials

Architecture codename Sandy Bridge
Launch date 1 October 2012
Launch price (MSRP) $86
Place in performance rating 3018
Processor Number 887
Series Legacy Intel® Celeron® Processor
Status Launched
Vertical segment Mobile

Performance

64 bit support
Base frequency 1.50 GHz
Bus Speed 5 GT/s DMI
Die size 131 mm
L1 cache 128 KB
L2 cache 512 KB
L3 cache 2048 KB
Manufacturing process technology 32 nm
Maximum core temperature 100 °C
Maximum frequency 1.5 GHz
Number of cores 2
Number of threads 2
Transistor count 504 million

Memory

Max memory channels 2
Maximum memory bandwidth 21.3 GB/s
Maximum memory size 16 GB
Supported memory types DDR3 1066/1333

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.00 GHz
Graphics max frequency 1 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel HD Graphics

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 2
SDVO
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 31.0mm x 24.0mm (BGA1023)
Sockets supported FCBGA1023
Thermal Design Power (TDP) 17 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16, 2x8, 1x8 2x4

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

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