Intel Celeron M U3600 processor review

Celeron M U3600 processor released by Intel; release date: 18 December 2010. The processor is designed for mobile-computers and based on Arrandale microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 1.2 GHz. Maximum operating temperature - 105°C. Manufacturing process technology - 32 nm. Cache size: L2 - 512 KB, L3 - 2048 KB.

Supported memory types: DDR3 800. Maximum memory size: 8 GB.

Supported socket types: BGA1288. Maximum number of processors in a configuration - 1. Power consumption (TDP): 18 Watt.

The processor has integrated graphics Intel HD Graphics.

Benchmarks

PassMark
Single thread mark

Top 1 CPU

This CPU

4870

523

PassMark
CPU mark

Top 1 CPU

This CPU

156834

579

Geekbench 4
Single Core

Top 1 CPU

This CPU

5311

899

Geekbench 4
Multi-Core

Top 1 CPU

This CPU

36691

1483

Name	Value
PassMark - Single thread mark	523
PassMark - CPU mark	579
Geekbench 4 - Single Core	899
Geekbench 4 - Multi-Core	1483

Specifications (specs)

Essentials
Architecture codename	Arrandale
Launch date	18 December 2010
Place in performance rating	2620
Processor Number	U3600
Series	Legacy Intel® Celeron® Processor
Status	Discontinued
Vertical segment	Mobile
Performance
64 bit support
Base frequency	1.20 GHz
Bus Speed	2.5 GT/s DMI
Die size	81 mm2
Front-side bus (FSB)	2500 MHz
L2 cache	512 KB
L3 cache	2048 KB
Manufacturing process technology	32 nm
Maximum core temperature	105°C
Maximum frequency	1.2 GHz
Number of cores	2
Number of threads	2
Transistor count	382 million

Memory
Max memory channels	2
Maximum memory bandwidth	12.8 GB/s
Maximum memory size	8 GB
Supported memory types	DDR3 800
Graphics
Graphics base frequency	166 MHz
Graphics max dynamic frequency	500 MHz
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics	Intel HD Graphics
Graphics interfaces
Number of displays supported	2
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	BGA 34mm x 28mm
Sockets supported	BGA1288
Thermal Design Power (TDP)	18 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)	36-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)