Intel Celeron N2806 processor review

Celeron N2806 processor released by Intel; release date: 1 December 2013. At the time of release, the processor cost $107. The processor is designed for mobile-computers and based on Bay Trail microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 2.00 GHz. Maximum operating temperature - 105°C. Manufacturing process technology - 22 nm. Cache size: L1 - 112 KB, L2 - 1 MB.

Supported memory types: DDR3L 1066. Maximum memory size: 4 GB.

Supported socket types: FCBGA1170. Maximum number of processors in a configuration - 1. Power consumption (TDP): 4.5 Watt.

The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 756 MHz.

Benchmarks

PassMark
Single thread mark

Top 1 CPU

This CPU

4870

537

PassMark
CPU mark

Top 1 CPU

This CPU

156834

489

GFXBench 4.0
T-Rex

Top 1 CPU

This CPU

12887 Frames

638 Frames

GFXBench 4.0
T-Rex

Top 1 CPU

This CPU

12887.000 Fps

638.000 Fps

Name	Value
PassMark - Single thread mark	537
PassMark - CPU mark	489
GFXBench 4.0 - T-Rex	638 Frames
GFXBench 4.0 - T-Rex	638.000 Fps

Specifications (specs)

Essentials
Architecture codename	Bay Trail
Launch date	1 December 2013
Launch price (MSRP)	$107
Place in performance rating	2977
Processor Number	N2806
Series	Intel® Celeron® Processor N Series
Status	Launched
Vertical segment	Mobile
Performance
64 bit support
Base frequency	1.60 GHz
L1 cache	112 KB
L2 cache	1 MB
Manufacturing process technology	22 nm
Maximum core temperature	105°C
Maximum frequency	2.00 GHz
Number of cores	2
Number of threads	2

Memory
Max memory channels	1
Maximum memory size	4 GB
Supported memory types	DDR3L 1066
Graphics
Graphics base frequency	313 MHz
Graphics max dynamic frequency	756 MHz
Graphics max frequency	756 MHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
Number of displays supported	2
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	25mm x 27mm
Scenario Design Power (SDP)	2.5 W
Sockets supported	FCBGA1170
Thermal Design Power (TDP)	4.5 Watt
Peripherals
Max number of PCIe lanes	4
Number of USB ports	5
PCI Express revision	2.0
Total number of SATA ports	2
USB revision	3.0 and 2.0
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Rapid Storage technology (RST)
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Smart Connect
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)