Intel Core 2 Duo E6850 processor review
Core 2 Duo E6850 processor released by Intel; release date: Q3'07. The processor is designed for desktop-computers and based on Conroe microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2. Maximum operating temperature - 72°C. Manufacturing process technology - 65 nm.
Supported socket types: PLGA775. Power consumption (TDP): 65 Watt.
Benchmarks
PassMark Single thread mark |
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PassMark CPU mark |
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Geekbench 4 Single Core |
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Geekbench 4 Multi-Core |
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Name | Value |
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PassMark - Single thread mark | 1183 |
PassMark - CPU mark | 1130 |
Geekbench 4 - Single Core | 401 |
Geekbench 4 - Multi-Core | 702 |
Specifications (specs)
Essentials |
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Architecture codename | Conroe |
Launch date | Q3'07 |
Place in performance rating | 2541 |
Processor Number | E6850 |
Series | Legacy Intel® Core™ Processors |
Status | Discontinued |
Vertical segment | Desktop |
Performance |
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64 bit support | |
Base frequency | 3.00 GHz |
Bus Speed | 1333 MHz FSB |
Die size | 143 mm2 |
Manufacturing process technology | 65 nm |
Maximum core temperature | 72°C |
Number of cores | 2 |
Transistor count | 291 million |
VID voltage range | 0.8500V-1.5V |
Compatibility |
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Low Halogen Options Available | |
Package Size | 37.5mm x 37.5mm |
Sockets supported | PLGA775 |
Thermal Design Power (TDP) | 65 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | |
Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | |
FSB parity | |
Idle States | |
Intel 64 | |
Intel® AES New Instructions | |
Intel® Demand Based Switching | |
Intel® Hyper-Threading technology | |
Intel® Turbo Boost technology | |
Thermal Monitoring | |
Virtualization |
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Intel® Virtualization Technology (VT-x) |