Intel Core 2 Duo P7550 processor review
Core 2 Duo P7550 processor released by Intel; release date: 1 October 2009. The processor is designed for mobile-computers and based on Penryn microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 2.26 GHz. Maximum operating temperature - 90°C. Manufacturing process technology - 45 nm. Cache size: L2 - 3 MB.
Supported socket types: PGA478. Power consumption (TDP): 25 Watt.
Benchmarks
| PassMark Single thread mark |
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| PassMark CPU mark |
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| Geekbench 4 Single Core |
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| Geekbench 4 Multi-Core |
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| CompuBench 1.5 Desktop Face Detection |
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| CompuBench 1.5 Desktop Ocean Surface Simulation |
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| CompuBench 1.5 Desktop T-Rex |
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| CompuBench 1.5 Desktop Video Composition |
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| CompuBench 1.5 Desktop Bitcoin Mining |
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| Name | Value |
|---|---|
| PassMark - Single thread mark | 974 |
| PassMark - CPU mark | 849 |
| Geekbench 4 - Single Core | 291 |
| Geekbench 4 - Multi-Core | 505 |
| CompuBench 1.5 Desktop - Face Detection | 0.247 mPixels/s |
| CompuBench 1.5 Desktop - Ocean Surface Simulation | 15.219 Frames/s |
| CompuBench 1.5 Desktop - T-Rex | 0.073 Frames/s |
| CompuBench 1.5 Desktop - Video Composition | 0.448 Frames/s |
| CompuBench 1.5 Desktop - Bitcoin Mining | 1.772 mHash/s |
Specifications (specs)
Essentials |
|
| Architecture codename | Penryn |
| Launch date | 1 October 2009 |
| Place in performance rating | 3197 |
| Price now | $229.99 |
| Processor Number | P7550 |
| Series | Legacy Intel® Core™ Processors |
| Status | Discontinued |
| Value for money (0-100) | 1.94 |
| Vertical segment | Mobile |
Performance |
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| 64 bit support | |
| Base frequency | 2.26 GHz |
| Bus Speed | 1066 MHz FSB |
| Die size | 107 mm2 |
| Front-side bus (FSB) | 1066 MHz |
| L2 cache | 3 MB |
| Manufacturing process technology | 45 nm |
| Maximum core temperature | 90°C |
| Maximum frequency | 2.26 GHz |
| Number of cores | 2 |
| Number of threads | 2 |
| Transistor count | 410 million |
Compatibility |
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| Low Halogen Options Available | |
| Package Size | 35mm x 35mm |
| Sockets supported | PGA478 |
| Thermal Design Power (TDP) | 25 Watt |
Security & Reliability |
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| Execute Disable Bit (EDB) | |
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | |
| Intel 64 | |
| Intel® Turbo Boost technology | |
Virtualization |
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| Intel® Virtualization Technology (VT-x) | |
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