Intel Core 2 Duo T5550 processor review
Core 2 Duo T5550 processor released by Intel; release date: 1 January 2008. The processor is designed for mobile-computers and based on Merom microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 1.83 GHz. Maximum operating temperature - 100°C. Manufacturing process technology - 65 nm. Cache size: L2 - 2048 KB.
Supported socket types: PPGA478. Power consumption (TDP): 35 Watt.
Benchmarks
PassMark Single thread mark |
|
|
||||
PassMark CPU mark |
|
|
||||
Geekbench 4 Single Core |
|
|
||||
Geekbench 4 Multi-Core |
|
|
Name | Value |
---|---|
PassMark - Single thread mark | 682 |
PassMark - CPU mark | 642 |
Geekbench 4 - Single Core | 243 |
Geekbench 4 - Multi-Core | 411 |
Specifications (specs)
Essentials |
|
Architecture codename | Merom |
Launch date | 1 January 2008 |
Place in performance rating | 3039 |
Processor Number | T5550 |
Series | Legacy Intel® Core™ Processors |
Status | Discontinued |
Vertical segment | Mobile |
Performance |
|
64 bit support | |
Base frequency | 1.83 GHz |
Bus Speed | 667 MHz FSB |
Die size | 143 mm2 |
Front-side bus (FSB) | 667 MHz |
L2 cache | 2048 KB |
Manufacturing process technology | 65 nm |
Maximum core temperature | 100°C |
Maximum frequency | 1.83 GHz |
Number of cores | 2 |
Number of threads | 2 |
Transistor count | 291 million |
VID voltage range | 1.075V-1.250V |
Compatibility |
|
Low Halogen Options Available | |
Package Size | 35mm x 35mm |
Sockets supported | PPGA478 |
Thermal Design Power (TDP) | 35 Watt |
Security & Reliability |
|
Execute Disable Bit (EDB) | |
Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
|
Enhanced Intel SpeedStep® technology | |
FSB parity | |
Intel 64 | |
Intel® Demand Based Switching | |
Intel® Hyper-Threading technology | |
Intel® Turbo Boost technology | |
Virtualization |
|
Intel® Virtualization Technology (VT-x) |