Intel Core 2 Duo L7500 vs Intel Core 2 Duo T5550
Comparative analysis of Intel Core 2 Duo L7500 and Intel Core 2 Duo T5550 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo L7500
- 2.1x lower typical power consumption: 17 Watt vs 35 Watt
- Around 2% better performance in PassMark - CPU mark: 657 vs 647
Specifications (specs) | |
Thermal Design Power (TDP) | 17 Watt vs 35 Watt |
Benchmarks | |
PassMark - CPU mark | 657 vs 647 |
Reasons to consider the Intel Core 2 Duo T5550
- Around 3% better performance in PassMark - Single thread mark: 684 vs 664
- Around 7% better performance in Geekbench 4 - Single Core: 243 vs 228
- Around 7% better performance in Geekbench 4 - Multi-Core: 411 vs 383
Benchmarks | |
PassMark - Single thread mark | 684 vs 664 |
Geekbench 4 - Single Core | 243 vs 228 |
Geekbench 4 - Multi-Core | 411 vs 383 |
Compare benchmarks
CPU 1: Intel Core 2 Duo L7500
CPU 2: Intel Core 2 Duo T5550
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core 2 Duo L7500 | Intel Core 2 Duo T5550 |
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PassMark - Single thread mark | 664 | 684 |
PassMark - CPU mark | 657 | 647 |
Geekbench 4 - Single Core | 228 | 243 |
Geekbench 4 - Multi-Core | 383 | 411 |
Compare specifications (specs)
Intel Core 2 Duo L7500 | Intel Core 2 Duo T5550 | |
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Essentials |
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Architecture codename | Merom | Merom |
Launch date | Q3'06 | 1 January 2008 |
Place in performance rating | 3045 | 3041 |
Processor Number | L7500 | T5550 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
Status | Discontinued | Discontinued |
Vertical segment | Mobile | Mobile |
Performance |
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64 bit support | ||
Base frequency | 1.60 GHz | 1.83 GHz |
Bus Speed | 800 MHz FSB | 667 MHz FSB |
Die size | 143 mm2 | 143 mm2 |
Manufacturing process technology | 65 nm | 65 nm |
Maximum core temperature | 100°C | 100°C |
Number of cores | 2 | 2 |
Transistor count | 291 million | 291 million |
VID voltage range | 0.975V - 1.062V | 1.075V-1.250V |
Front-side bus (FSB) | 667 MHz | |
L2 cache | 2048 KB | |
Maximum frequency | 1.83 GHz | |
Number of threads | 2 | |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 35mm x 35mm | 35mm x 35mm |
Sockets supported | PBGA479 | PPGA478 |
Thermal Design Power (TDP) | 17 Watt | 35 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) |