Intel Core i3-370M processor review
Core i3-370M processor released by Intel; release date: 10 January 2010. At the time of release, the processor cost $245. The processor is designed for mobile-computers and based on Arrandale microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 4. Maximum CPU clock speed - 2.4 GHz. Maximum operating temperature - 90°C for rPGA, 105°C for BGA. Manufacturing process technology - 32 nm. Cache size: L1 - 64 KB (per core), L2 - 512 KB, L3 - 3072 KB.
Supported memory types: DDR3 800/1066. Maximum memory size: 8 GB.
Supported socket types: PGA988. Maximum number of processors in a configuration - 1. Power consumption (TDP): 35 Watt.
The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 667 MHz.
Benchmarks
PassMark Single thread mark |
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PassMark CPU mark |
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Geekbench 4 Single Core |
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Geekbench 4 Multi-Core |
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CompuBench 1.5 Desktop Face Detection |
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CompuBench 1.5 Desktop Ocean Surface Simulation |
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CompuBench 1.5 Desktop Bitcoin Mining |
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CompuBench 1.5 Desktop T-Rex |
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Name | Value |
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PassMark - Single thread mark | 976 |
PassMark - CPU mark | 1158 |
Geekbench 4 - Single Core | 343 |
Geekbench 4 - Multi-Core | 750 |
CompuBench 1.5 Desktop - Face Detection | 0.288 mPixels/s |
CompuBench 1.5 Desktop - Ocean Surface Simulation | 9.804 Frames/s |
CompuBench 1.5 Desktop - Bitcoin Mining | 1.677 mHash/s |
CompuBench 1.5 Desktop - T-Rex | 0.175 Frames/s |
Specifications (specs)
Essentials |
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Architecture codename | Arrandale |
Launch date | 10 January 2010 |
Launch price (MSRP) | $245 |
Place in performance rating | 3115 |
Price now | $39.96 |
Processor Number | i3-370M |
Series | Legacy Intel® Core™ Processors |
Status | Discontinued |
Value for money (0-100) | 14.87 |
Vertical segment | Mobile |
Performance |
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64 bit support | |
Base frequency | 2.40 GHz |
Bus Speed | 2.5 GT/s DMI |
Die size | 81 mm2 |
Front-side bus (FSB) | 2500 MHz |
L1 cache | 64 KB (per core) |
L2 cache | 512 KB |
L3 cache | 3072 KB |
Manufacturing process technology | 32 nm |
Maximum core temperature | 90°C for rPGA, 105°C for BGA |
Maximum frequency | 2.4 GHz |
Number of cores | 2 |
Number of threads | 4 |
Transistor count | 382 million |
Memory |
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Max memory channels | 2 |
Maximum memory bandwidth | 17.1 GB/s |
Maximum memory size | 8 GB |
Supported memory types | DDR3 800/1066 |
Graphics |
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Graphics base frequency | 500 MHz |
Graphics max dynamic frequency | 667 MHz |
Graphics max frequency | 667 MHz |
Intel® Clear Video HD technology | |
Intel® Clear Video technology | |
Intel® Flexible Display Interface (Intel® FDI) | |
Processor graphics | Intel HD Graphics |
Graphics interfaces |
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Number of displays supported | 2 |
Compatibility |
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Low Halogen Options Available | |
Max number of CPUs in a configuration | 1 |
Package Size | rPGA 37.5mmx 37.5mm, BGA 34mmx28mm |
Sockets supported | PGA988 |
Thermal Design Power (TDP) | 35 Watt |
Peripherals |
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Max number of PCIe lanes | 16 |
PCI Express revision | 2.0 |
PCIe configurations | 1x16 |
Security & Reliability |
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Execute Disable Bit (EDB) | |
Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | |
Flexible Display interface (FDI) | |
Idle States | |
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 | |
Intel® AES New Instructions | |
Intel® Fast Memory Access | |
Intel® Flex Memory Access | |
Intel® Hyper-Threading technology | |
Intel® Turbo Boost technology | |
Intel® vPro™ Platform Eligibility | |
Physical Address Extensions (PAE) | 36-bit |
Thermal Monitoring | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | |
Intel® Virtualization Technology for Directed I/O (VT-d) | |
Intel® VT-x with Extended Page Tables (EPT) |