Intel Core i3-370M vs Intel Pentium Dual Core T2370
Comparative analysis of Intel Core i3-370M and Intel Pentium Dual Core T2370 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), CompuBench 1.5 Desktop - T-Rex (Frames/s).
Differences
Reasons to consider the Intel Core i3-370M
- CPU is newer: launch date 2 year(s) 0 month(s) later
- 2 more threads: 4 vs 2
- Around 39% higher clock speed: 2.4 GHz vs 1.73 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
- Around 64% better performance in PassMark - Single thread mark: 974 vs 594
- 2.1x better performance in PassMark - CPU mark: 1154 vs 558
- Around 62% better performance in Geekbench 4 - Single Core: 343 vs 212
- 2.1x better performance in Geekbench 4 - Multi-Core: 750 vs 359
| Specifications (specs) | |
| Launch date | 10 January 2010 vs 1 January 2008 |
| Number of threads | 4 vs 2 |
| Maximum frequency | 2.4 GHz vs 1.73 GHz |
| Manufacturing process technology | 32 nm vs 65 nm |
| Benchmarks | |
| PassMark - Single thread mark | 974 vs 594 |
| PassMark - CPU mark | 1154 vs 558 |
| Geekbench 4 - Single Core | 343 vs 212 |
| Geekbench 4 - Multi-Core | 750 vs 359 |
Reasons to consider the Intel Pentium Dual Core T2370
- Around 11% higher maximum core temperature: 100°C vs 90°C for rPGA, 105°C for BGA
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
| Maximum core temperature | 100°C vs 90°C for rPGA, 105°C for BGA |
| L2 cache | 1024 KB vs 512 KB |
Compare benchmarks
CPU 1: Intel Core i3-370M
CPU 2: Intel Pentium Dual Core T2370
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | Intel Core i3-370M | Intel Pentium Dual Core T2370 |
|---|---|---|
| PassMark - Single thread mark | 974 | 594 |
| PassMark - CPU mark | 1154 | 558 |
| Geekbench 4 - Single Core | 343 | 212 |
| Geekbench 4 - Multi-Core | 750 | 359 |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 0.288 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 9.804 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 1.677 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.175 |
Compare specifications (specs)
| Intel Core i3-370M | Intel Pentium Dual Core T2370 | |
|---|---|---|
Essentials |
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| Architecture codename | Arrandale | Merom |
| Launch date | 10 January 2010 | 1 January 2008 |
| Launch price (MSRP) | $245 | |
| Place in performance rating | 3114 | 3122 |
| Price now | $39.96 | |
| Processor Number | i3-370M | T2370 |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Pentium® Processor |
| Status | Discontinued | Discontinued |
| Value for money (0-100) | 14.87 | |
| Vertical segment | Mobile | Mobile |
Performance |
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| 64 bit support | ||
| Base frequency | 2.40 GHz | 1.73 GHz |
| Bus Speed | 2.5 GT/s DMI | 533 MHz FSB |
| Die size | 81 mm2 | 143 mm2 |
| Front-side bus (FSB) | 2500 MHz | 533 MHz |
| L1 cache | 64 KB (per core) | |
| L2 cache | 512 KB | 1024 KB |
| L3 cache | 3072 KB | |
| Manufacturing process technology | 32 nm | 65 nm |
| Maximum core temperature | 90°C for rPGA, 105°C for BGA | 100°C |
| Maximum frequency | 2.4 GHz | 1.73 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 4 | 2 |
| Transistor count | 382 million | 291 million |
| VID voltage range | 1.075V-1.175V | |
Memory |
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| Max memory channels | 2 | |
| Maximum memory bandwidth | 17.1 GB/s | |
| Maximum memory size | 8 GB | |
| Supported memory types | DDR3 800/1066 | |
Graphics |
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| Graphics base frequency | 500 MHz | |
| Graphics max dynamic frequency | 667 MHz | |
| Graphics max frequency | 667 MHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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| Number of displays supported | 2 | |
Compatibility |
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| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | rPGA 37.5mmx 37.5mm, BGA 34mmx28mm | 35mm x 35mm |
| Sockets supported | PGA988 | PPGA478 |
| Thermal Design Power (TDP) | 35 Watt | 35 Watt |
Peripherals |
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| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Physical Address Extensions (PAE) | 36-bit | |
| Thermal Monitoring | ||
| FSB parity | ||
| Intel® Demand Based Switching | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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