Intel Core i3-370M vs Intel Pentium Dual Core T2370

Comparative analysis of Intel Core i3-370M and Intel Pentium Dual Core T2370 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), CompuBench 1.5 Desktop - T-Rex (Frames/s).

 

Differences

Reasons to consider the Intel Core i3-370M

  • CPU is newer: launch date 2 year(s) 0 month(s) later
  • 2 more threads: 4 vs 2
  • Around 39% higher clock speed: 2.4 GHz vs 1.73 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
  • Around 64% better performance in PassMark - Single thread mark: 976 vs 594
  • 2.1x better performance in PassMark - CPU mark: 1158 vs 558
  • Around 62% better performance in Geekbench 4 - Single Core: 343 vs 212
  • 2.1x better performance in Geekbench 4 - Multi-Core: 750 vs 359
Specifications (specs)
Launch date 10 January 2010 vs 1 January 2008
Number of threads 4 vs 2
Maximum frequency 2.4 GHz vs 1.73 GHz
Manufacturing process technology 32 nm vs 65 nm
Benchmarks
PassMark - Single thread mark 976 vs 594
PassMark - CPU mark 1158 vs 558
Geekbench 4 - Single Core 343 vs 212
Geekbench 4 - Multi-Core 750 vs 359

Reasons to consider the Intel Pentium Dual Core T2370

  • Around 11% higher maximum core temperature: 100°C vs 90°C for rPGA, 105°C for BGA
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum core temperature 100°C vs 90°C for rPGA, 105°C for BGA
L2 cache 1024 KB vs 512 KB

Compare benchmarks

CPU 1: Intel Core i3-370M
CPU 2: Intel Pentium Dual Core T2370

PassMark - Single thread mark
CPU 1
CPU 2
976
594
PassMark - CPU mark
CPU 1
CPU 2
1158
558
Geekbench 4 - Single Core
CPU 1
CPU 2
343
212
Geekbench 4 - Multi-Core
CPU 1
CPU 2
750
359
Name Intel Core i3-370M Intel Pentium Dual Core T2370
PassMark - Single thread mark 976 594
PassMark - CPU mark 1158 558
Geekbench 4 - Single Core 343 212
Geekbench 4 - Multi-Core 750 359
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 0.288
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 9.804
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 1.677
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.175

Compare specifications (specs)

Intel Core i3-370M Intel Pentium Dual Core T2370

Essentials

Architecture codename Arrandale Merom
Launch date 10 January 2010 1 January 2008
Launch price (MSRP) $245
Place in performance rating 3114 3122
Price now $39.96
Processor Number i3-370M T2370
Series Legacy Intel® Core™ Processors Legacy Intel® Pentium® Processor
Status Discontinued Discontinued
Value for money (0-100) 14.87
Vertical segment Mobile Mobile

Performance

64 bit support
Base frequency 2.40 GHz 1.73 GHz
Bus Speed 2.5 GT/s DMI 533 MHz FSB
Die size 81 mm2 143 mm2
Front-side bus (FSB) 2500 MHz 533 MHz
L1 cache 64 KB (per core)
L2 cache 512 KB 1024 KB
L3 cache 3072 KB
Manufacturing process technology 32 nm 65 nm
Maximum core temperature 90°C for rPGA, 105°C for BGA 100°C
Maximum frequency 2.4 GHz 1.73 GHz
Number of cores 2 2
Number of threads 4 2
Transistor count 382 million 291 million
VID voltage range 1.075V-1.175V

Memory

Max memory channels 2
Maximum memory bandwidth 17.1 GB/s
Maximum memory size 8 GB
Supported memory types DDR3 800/1066

Graphics

Graphics base frequency 500 MHz
Graphics max dynamic frequency 667 MHz
Graphics max frequency 667 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics Intel HD Graphics

Graphics interfaces

Number of displays supported 2

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size rPGA 37.5mmx 37.5mm, BGA 34mmx28mm 35mm x 35mm
Sockets supported PGA988 PPGA478
Thermal Design Power (TDP) 35 Watt 35 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 36-bit
Thermal Monitoring
FSB parity
Intel® Demand Based Switching

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

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