Intel Pentium 957 processor review
Pentium 957 processor released by Intel; release date: 19 June 2011. At the time of release, the processor cost $134. The processor is designed for mobile-computers and based on Sandy Bridge microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 1.2 GHz. Maximum operating temperature - 100. Manufacturing process technology - 32 nm. Cache size: L1 - 128 KB, L2 - 512 KB, L3 - 2 MB.
Supported memory types: DDR3 1066/1333. Maximum memory size: 8.01 GB.
Supported socket types: FCBGA1023. Maximum number of processors in a configuration - 1. Power consumption (TDP): 17 Watt.
Benchmarks
PassMark Single thread mark |
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PassMark CPU mark |
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Name | Value |
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PassMark - Single thread mark | 574 |
PassMark - CPU mark | 622 |
Specifications (specs)
Essentials |
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Architecture codename | Sandy Bridge |
Launch date | 19 June 2011 |
Launch price (MSRP) | $134 |
Place in performance rating | 2859 |
Price now | $134 |
Processor Number | 957 |
Series | Legacy Intel® Pentium® Processor |
Status | Launched |
Value for money (0-100) | 2.41 |
Vertical segment | Mobile |
Performance |
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64 bit support | |
Base frequency | 1.20 GHz |
Die size | 131 mm |
L1 cache | 128 KB |
L2 cache | 512 KB |
L3 cache | 2 MB |
Manufacturing process technology | 32 nm |
Maximum core temperature | 100 |
Maximum frequency | 1.2 GHz |
Number of cores | 2 |
Number of threads | 2 |
Transistor count | 504 million |
Memory |
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Max memory channels | 2 |
Maximum memory bandwidth | 21.3 GB/s |
Maximum memory size | 8.01 GB |
Supported memory types | DDR3 1066/1333 |
Graphics |
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Graphics base frequency | 350 MHz |
Graphics max dynamic frequency | 800 MHz |
Graphics max frequency | 800 MHz |
Intel® Clear Video HD technology | |
Intel® Flexible Display Interface (Intel® FDI) | |
Intel® InTru™ 3D technology | |
Intel® Quick Sync Video | |
Graphics interfaces |
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CRT | |
DisplayPort | |
eDP | |
HDMI | |
Number of displays supported | 2 |
SDVO | |
Wireless Display (WiDi) support | |
Compatibility |
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Low Halogen Options Available | |
Max number of CPUs in a configuration | 1 |
Package Size | 31.0mm x 24.0mm (BGA1023) |
Sockets supported | FCBGA1023 |
Thermal Design Power (TDP) | 17 Watt |
Peripherals |
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Max number of PCIe lanes | 16 |
PCI Express revision | 2.0 |
PCIe configurations | 1x16, 2x8, 1x8 2x4 |
Security & Reliability |
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Anti-Theft technology | |
Execute Disable Bit (EDB) | |
Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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4G WiMAX Wireless | |
Enhanced Intel SpeedStep® technology | |
Flexible Display interface (FDI) | |
Idle States | |
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 | |
Intel® AES New Instructions | |
Intel® Demand Based Switching | |
Intel® Fast Memory Access | |
Intel® Flex Memory Access | |
Intel® Hyper-Threading technology | |
Intel® My WiFi technology | |
Intel® Turbo Boost technology | |
Intel® vPro™ Platform Eligibility | |
Thermal Monitoring | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | |
Intel® Virtualization Technology for Directed I/O (VT-d) |