Intel Pentium G3430 processor review
Pentium G3430 processor released by Intel; release date: September 2013. At the time of release, the processor cost $116. The processor is designed for desktop-computers and based on Haswell microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 3.3 GHz. Maximum operating temperature - 72°C. Manufacturing process technology - 22 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 3072 KB (shared).
Supported memory types: DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V. Maximum memory size: 32 GB.
Supported socket types: FCLGA1150. Maximum number of processors in a configuration - 1. Power consumption (TDP): 53 Watt.
The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 1.1 GHz, maximum video memory size - 1.7 GB.
Benchmarks
PassMark Single thread mark |
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PassMark CPU mark |
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Geekbench 4 Single Core |
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Geekbench 4 Multi-Core |
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Name | Value |
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PassMark - Single thread mark | 1912 |
PassMark - CPU mark | 2127 |
Geekbench 4 - Single Core | 3295 |
Geekbench 4 - Multi-Core | 5528 |
Specifications (specs)
Essentials |
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Architecture codename | Haswell |
Launch date | September 2013 |
Launch price (MSRP) | $116 |
Place in performance rating | 916 |
Price now | $89.99 |
Processor Number | G3430 |
Series | Intel® Pentium® Processor G Series |
Status | Discontinued |
Value for money (0-100) | 11.11 |
Vertical segment | Desktop |
Performance |
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64 bit support | |
Base frequency | 3.30 GHz |
Bus Speed | 5 GT/s DMI2 |
Die size | 177 mm |
L1 cache | 64 KB (per core) |
L2 cache | 256 KB (per core) |
L3 cache | 3072 KB (shared) |
Manufacturing process technology | 22 nm |
Maximum case temperature (TCase) | 72 °C |
Maximum core temperature | 72°C |
Maximum frequency | 3.3 GHz |
Number of cores | 2 |
Number of threads | 2 |
Transistor count | 1400 million |
Memory |
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ECC memory support | |
Max memory channels | 2 |
Maximum memory bandwidth | 25.6 GB/s |
Maximum memory size | 32 GB |
Supported memory types | DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V |
Graphics |
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Graphics base frequency | 350 MHz |
Graphics max dynamic frequency | 1.10 GHz |
Graphics max frequency | 1.1 GHz |
Intel® Clear Video HD technology | |
Intel® Quick Sync Video | |
Max video memory | 1.7 GB |
Processor graphics | Intel HD Graphics |
Graphics interfaces |
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DisplayPort | |
DVI | |
eDP | |
HDMI | |
Number of displays supported | 3 |
VGA | |
Graphics image quality |
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Max resolution over DisplayPort | 2560x1600@60Hz |
Max resolution over eDP | 2560x1600@60Hz |
Max resolution over HDMI 1.4 | 1920x1080@60Hz |
Max resolution over VGA | 1920x1200@60Hz |
Graphics API support |
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DirectX | 11.1/12 |
OpenGL | 4.3 |
Compatibility |
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Low Halogen Options Available | |
Max number of CPUs in a configuration | 1 |
Package Size | 37.5mm x 37.5mm |
Sockets supported | FCLGA1150 |
Thermal Design Power (TDP) | 53 Watt |
Thermal Solution | PCG 2013C |
Peripherals |
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Max number of PCIe lanes | 16 |
PCI Express revision | Up to 3.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 |
Scalability | 1S Only |
Security & Reliability |
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Execute Disable Bit (EDB) | |
Intel® Secure Key technology | |
Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | |
Idle States | |
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 | |
Intel® AES New Instructions | |
Intel® Hyper-Threading technology | |
Intel® Optane™ Memory Supported | |
Intel® Stable Image Platform Program (SIPP) | |
Intel® TSX-NI | |
Intel® Turbo Boost technology | |
Intel® vPro™ Platform Eligibility | |
Thermal Monitoring | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | |
Intel® Virtualization Technology for Directed I/O (VT-d) | |
Intel® VT-x with Extended Page Tables (EPT) |