AMD Ryzen 3 PRO 4200G vs Intel Pentium G3430
Comparative analysis of AMD Ryzen 3 PRO 4200G and Intel Pentium G3430 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics interfaces, Graphics image quality, Graphics API support, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Ryzen 3 PRO 4200G
- 2 more cores, run more applications at once: 4 vs 2
- 6 more threads: 8 vs 2
- Around 24% higher clock speed: 4.1 GHz vs 3.3 GHz
- Around 32% higher maximum core temperature: 95° C vs 72°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 22 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 33% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 34% better performance in PassMark - Single thread mark: 2554 vs 1912
- 5.1x better performance in PassMark - CPU mark: 10831 vs 2127
| Specifications (specs) | |
| Number of cores | 4 vs 2 |
| Number of threads | 8 vs 2 |
| Maximum frequency | 4.1 GHz vs 3.3 GHz |
| Maximum core temperature | 95° C vs 72°C |
| Manufacturing process technology | 7 nm vs 22 nm |
| L1 cache | 256 KB vs 64 KB (per core) |
| L2 cache | 2 MB vs 256 KB (per core) |
| L3 cache | 4 MB vs 3072 KB (shared) |
| Benchmarks | |
| PassMark - Single thread mark | 2554 vs 1912 |
| PassMark - CPU mark | 10831 vs 2127 |
Reasons to consider the Intel Pentium G3430
- Around 23% lower typical power consumption: 53 Watt vs 65 Watt
| Thermal Design Power (TDP) | 53 Watt vs 65 Watt |
Compare benchmarks
CPU 1: AMD Ryzen 3 PRO 4200G
CPU 2: Intel Pentium G3430
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | AMD Ryzen 3 PRO 4200G | Intel Pentium G3430 |
|---|---|---|
| PassMark - Single thread mark | 2554 | 1912 |
| PassMark - CPU mark | 10831 | 2127 |
| Geekbench 4 - Single Core | 3295 | |
| Geekbench 4 - Multi-Core | 5528 |
Compare specifications (specs)
| AMD Ryzen 3 PRO 4200G | Intel Pentium G3430 | |
|---|---|---|
Essentials |
||
| Architecture codename | Zen 2 | Haswell |
| Launch date | Q3'2020 | September 2013 |
| Place in performance rating | 909 | 907 |
| Vertical segment | Desktop | Desktop |
| Launch price (MSRP) | $116 | |
| Price now | $89.99 | |
| Processor Number | G3430 | |
| Series | Intel® Pentium® Processor G Series | |
| Status | Discontinued | |
| Value for money (0-100) | 11.11 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 3.8 GHz | 3.30 GHz |
| L1 cache | 256 KB | 64 KB (per core) |
| L2 cache | 2 MB | 256 KB (per core) |
| L3 cache | 4 MB | 3072 KB (shared) |
| Manufacturing process technology | 7 nm | 22 nm |
| Maximum core temperature | 95° C | 72°C |
| Maximum frequency | 4.1 GHz | 3.3 GHz |
| Number of cores | 4 | 2 |
| Number of threads | 8 | 2 |
| Transistor count | 9800 million | 1400 million |
| Unlocked | ||
| Bus Speed | 5 GT/s DMI2 | |
| Die size | 177 mm | |
| Maximum case temperature (TCase) | 72 °C | |
Memory |
||
| Max memory channels | 2 | 2 |
| Supported memory types | DDR4-3200 | DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V |
| ECC memory support | ||
| Maximum memory bandwidth | 25.6 GB/s | |
| Maximum memory size | 32 GB | |
Graphics |
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| Graphics base frequency | 1700 MHz | 350 MHz |
| Number of pipelines | 384 | |
| Processor graphics | Radeon RX Vega 6 (Ryzen 4000) | Intel HD Graphics |
| Graphics max dynamic frequency | 1.10 GHz | |
| Graphics max frequency | 1.1 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 1.7 GB | |
Compatibility |
||
| Sockets supported | FP6 | FCLGA1150 |
| Thermal Design Power (TDP) | 65 Watt | 53 Watt |
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 37.5mm x 37.5mm | |
| Thermal Solution | PCG 2013C | |
Peripherals |
||
| Max number of PCIe lanes | 16 | 16 |
| PCI Express revision | 3.0 | Up to 3.0 |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
| Scalability | 1S Only | |
Advanced Technologies |
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| Enhanced Virus Protection (EVP) | ||
| Fused Multiply-Add 3 (FMA3) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® Advanced Vector Extensions 2 (AVX2) | ||
| Intel® AES New Instructions | ||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
| Intel 64 | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
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| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics interfaces |
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| DisplayPort | ||
| DVI | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | |
| VGA | ||
Graphics image quality |
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| Max resolution over DisplayPort | 2560x1600@60Hz | |
| Max resolution over eDP | 2560x1600@60Hz | |
| Max resolution over HDMI 1.4 | 1920x1080@60Hz | |
| Max resolution over VGA | 1920x1200@60Hz | |
Graphics API support |
||
| DirectX | 11.1/12 | |
| OpenGL | 4.3 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Secure Key technology | ||
| Intel® Trusted Execution technology (TXT) | ||