Intel Pentium G622 processor review
Pentium G622 processor released by Intel; release date: May 2011. The processor is designed for desktop-computers and based on Sandy Bridge microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 2.6 GHz. Maximum operating temperature - 69.1°C. Manufacturing process technology - 32 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 3072 KB (shared).
Supported memory types: DDR3 1066. Maximum memory size: 32 GB.
Supported socket types: 1155. Maximum number of processors in a configuration - 1. Power consumption (TDP): 65 Watt.
The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 1.1 GHz.
Specifications (specs)
Essentials |
|
Architecture codename | Sandy Bridge |
Launch date | May 2011 |
Place in performance rating | not rated |
Processor Number | G622 |
Series | Legacy Intel® Pentium® Processor |
Status | Discontinued |
Vertical segment | Desktop |
Performance |
|
64 bit support | |
Base frequency | 2.60 GHz |
Bus Speed | 5 GT/s DMI |
Die size | 131 mm |
L1 cache | 64 KB (per core) |
L2 cache | 256 KB (per core) |
L3 cache | 3072 KB (shared) |
Manufacturing process technology | 32 nm |
Maximum core temperature | 69.1°C |
Maximum frequency | 2.6 GHz |
Number of cores | 2 |
Number of threads | 2 |
Transistor count | 504 million |
Memory |
|
Max memory channels | 2 |
Maximum memory bandwidth | 17 GB/s |
Maximum memory size | 32 GB |
Supported memory types | DDR3 1066 |
Graphics |
|
Graphics base frequency | 850 MHz |
Graphics max dynamic frequency | 1.10 GHz |
Graphics max frequency | 1.1 GHz |
Intel® Clear Video HD technology | |
Intel® Flexible Display Interface (Intel® FDI) | |
Intel® InTru™ 3D technology | |
Intel® Quick Sync Video | |
Processor graphics | Intel HD Graphics |
Graphics interfaces |
|
Number of displays supported | 2 |
Wireless Display (WiDi) support | |
Compatibility |
|
Low Halogen Options Available | |
Max number of CPUs in a configuration | 1 |
Package Size | 37.5mm x 37.5mm |
Sockets supported | 1155 |
Thermal Design Power (TDP) | 65 Watt |
Peripherals |
|
PCI Express revision | 2.0 |
Security & Reliability |
|
Execute Disable Bit (EDB) | |
Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
|
Enhanced Intel SpeedStep® technology | |
Flexible Display interface (FDI) | |
Idle States | |
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 | |
Intel® Advanced Vector Extensions (AVX) | |
Intel® AES New Instructions | |
Intel® Fast Memory Access | |
Intel® Flex Memory Access | |
Intel® Hyper-Threading technology | |
Intel® Optane™ Memory Supported | |
Intel® Turbo Boost technology | |
Intel® vPro™ Platform Eligibility | |
Thermal Monitoring | |
Virtualization |
|
Intel® Virtualization Technology (VT-x) | |
Intel® Virtualization Technology for Directed I/O (VT-d) | |
Intel® VT-x with Extended Page Tables (EPT) |