Intel Pentium J2850 processor review
Pentium J2850 processor released by Intel; release date: 1 September 2013. At the time of release, the processor cost $94. The processor is designed for desktop-computers and based on Bay Trail microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 4, threads - 4. Maximum CPU clock speed - 2.41 GHz. Maximum operating temperature - 100°C. Manufacturing process technology - 22 nm. Cache size: L1 - 224 KB, L2 - 2 MB.
Supported memory types: DDR3L 1333. Maximum memory size: 8 GB.
Supported socket types: FCBGA1170. Maximum number of processors in a configuration - 1. Power consumption (TDP): 10 Watt.
The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 854 MHz.
Benchmarks
PassMark Single thread mark |
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PassMark CPU mark |
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Name | Value |
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PassMark - Single thread mark | 646 |
PassMark - CPU mark | 1016 |
Specifications (specs)
Essentials |
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Architecture codename | Bay Trail |
Launch date | 1 September 2013 |
Launch price (MSRP) | $94 |
Place in performance rating | 2749 |
Processor Number | J2850 |
Series | Intel® Pentium® Processor J Series |
Status | Launched |
Vertical segment | Desktop |
Performance |
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64 bit support | |
Base frequency | 2.41 GHz |
L1 cache | 224 KB |
L2 cache | 2 MB |
Manufacturing process technology | 22 nm |
Maximum core temperature | 100°C |
Maximum frequency | 2.41 GHz |
Number of cores | 4 |
Number of threads | 4 |
Memory |
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Max memory channels | 2 |
Maximum memory size | 8 GB |
Supported memory types | DDR3L 1333 |
Graphics |
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Graphics base frequency | 688 MHz |
Graphics max dynamic frequency | 854 MHz |
Graphics max frequency | 854 MHz |
Intel® Flexible Display Interface (Intel® FDI) | |
Intel® InTru™ 3D technology | |
Intel® Quick Sync Video | |
Processor graphics | Intel HD Graphics |
Graphics interfaces |
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Number of displays supported | 2 |
Compatibility |
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Low Halogen Options Available | |
Max number of CPUs in a configuration | 1 |
Package Size | 25mm X 27mm |
Sockets supported | FCBGA1170 |
Thermal Design Power (TDP) | 10 Watt |
Peripherals |
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Max number of PCIe lanes | 4 |
PCI Express revision | 2.0 |
PCIe configurations | X4, X2, X1 |
Security & Reliability |
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Anti-Theft technology | |
Execute Disable Bit (EDB) | |
Intel® Identity Protection technology | |
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | |
Flexible Display interface (FDI) | |
Intel 64 | |
Intel® AES New Instructions | |
Intel® Hyper-Threading technology | |
Intel® Optane™ Memory Supported | |
Intel® Rapid Storage technology (RST) | |
Intel® Stable Image Platform Program (SIPP) | |
Intel® Turbo Boost technology | |
Intel® vPro™ Platform Eligibility | |
Physical Address Extensions (PAE) | 36-bit |
Virtualization |
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Intel® Virtualization Technology (VT-x) | |
Intel® Virtualization Technology for Directed I/O (VT-d) |