Intel Xeon E-2276M processor review
Xeon E-2276M processor released by Intel; release date: 27 May 2019. At the time of release, the processor cost $450. The processor is designed for mobile-computers and based on Coffee Lake microarchitecture.
CPU is unlocked for overclocking. Total number of cores - 6, threads - 12. Maximum CPU clock speed - 4.70 GHz. Maximum operating temperature - 100 °C. Manufacturing process technology - 14 nm. Cache size: L1 - 384 KB, L2 - 1.5 MB, L3 - 12 MiB.
Supported memory types: DDR4-2666, LPDDR3-2133. Maximum memory size: 128 GB.
Supported socket types: FCBGA1440. Maximum number of processors in a configuration - 1. Power consumption (TDP): 45 Watt.
The processor has integrated graphics Intel UHD Graphics P630 with the following parameters: maximum video memory size - 64 GB.
Benchmarks
| PassMark Single thread mark |
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| PassMark CPU mark |
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| GFXBench 4.0 Car Chase Offscreen |
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| GFXBench 4.0 Car Chase Offscreen |
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| GFXBench 4.0 Manhattan |
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| GFXBench 4.0 Manhattan |
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| GFXBench 4.0 T-Rex |
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| GFXBench 4.0 T-Rex |
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| Name | Value |
|---|---|
| PassMark - Single thread mark | 2612 |
| PassMark - CPU mark | 11806 |
| GFXBench 4.0 - Car Chase Offscreen | 1693 Frames |
| GFXBench 4.0 - Car Chase Offscreen | 1693.000 Fps |
| GFXBench 4.0 - Manhattan | 3233 Frames |
| GFXBench 4.0 - Manhattan | 3233.000 Fps |
| GFXBench 4.0 - T-Rex | 3359 Frames |
| GFXBench 4.0 - T-Rex | 3359.000 Fps |
Integrated graphics – Intel UHD Graphics P630
Technical info |
|
| Boost clock speed | 1200 MHz |
| Core clock speed | 350 MHz |
| Pipelines | 24 |
Specifications (specs)
Essentials |
|
| Architecture codename | Coffee Lake |
| Family | Xeon E |
| Launch date | 27 May 2019 |
| Launch price (MSRP) | $450 |
| Place in performance rating | 870 |
| Processor Number | E-2276M |
| Series | E-2200 |
| Vertical segment | Mobile |
Performance |
|
| 64 bit support | |
| Base frequency | 2.80 GHz |
| Bus Speed | 8 GT/s DMI |
| L1 cache | 384 KB |
| L2 cache | 1.5 MB |
| L3 cache | 12 MiB |
| Manufacturing process technology | 14 nm |
| Maximum core temperature | 100 °C |
| Maximum frequency | 4.70 GHz |
| Number of cores | 6 |
| Number of threads | 12 |
| Unlocked | |
Memory |
|
| ECC memory support | |
| Max memory channels | 2 |
| Maximum memory bandwidth | 41.8 GB/s |
| Maximum memory size | 128 GB |
| Supported memory types | DDR4-2666, LPDDR3-2133 |
Graphics |
|
| Device ID | 0x3E94 |
| Graphics base frequency | 350 MHz |
| Graphics max dynamic frequency | 1.20 GHz |
| Intel® Clear Video HD technology | |
| Intel® Clear Video technology | |
| Intel® InTru™ 3D technology | |
| Intel® Quick Sync Video | |
| Max video memory | 64 GB |
| Processor graphics | Intel UHD Graphics P630 |
Graphics interfaces |
|
| DisplayPort | |
| DVI | |
| eDP | |
| HDMI | |
| Number of displays supported | 3 |
Graphics image quality |
|
| 4K resolution support | |
| Max resolution over DisplayPort | 4096x2304@60Hz |
| Max resolution over eDP | 4096x2304@60Hz |
| Max resolution over HDMI 1.4 | 4096x2304@30Hz |
Graphics API support |
|
| DirectX | 12 |
| OpenGL | 4.5 |
Compatibility |
|
| Configurable TDP-down | 35 Watt |
| Max number of CPUs in a configuration | 1 |
| Sockets supported | FCBGA1440 |
| Thermal Design Power (TDP) | 45 Watt |
Peripherals |
|
| Max number of PCIe lanes | 16 |
| PCI Express revision | 3.0 |
| PCIe configurations | 1x16, 2x8, 1x8+2x4 |
Security & Reliability |
|
| Execute Disable Bit (EDB) | |
| Intel® Identity Protection technology | |
| Intel® Memory Protection Extensions (Intel® MPX) | |
| Intel® OS Guard | |
| Intel® Secure Key technology | |
| Intel® Software Guard Extensions (Intel® SGX) | |
| Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
|
| Enhanced Intel SpeedStep® technology | |
| Idle States | |
| Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 |
| Intel 64 | |
| Intel® Advanced Vector Extensions 2 (AVX2) | |
| Intel® AES New Instructions | |
| Intel® Flex Memory Access | |
| Intel® My WiFi technology | |
| Intel® Optane™ Memory Supported | |
| Intel® Stable Image Platform Program (SIPP) | |
| Intel® Thermal Velocity Boost | |
| Intel® TSX-NI | |
| Intel® Turbo Boost technology | |
| Intel® vPro™ Platform Eligibility | |
| Speed Shift technology | |
| Thermal Monitoring | |
Virtualization |
|
| Intel® Virtualization Technology (VT-x) | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | |
| Intel® VT-x with Extended Page Tables (EPT) | |
Navigation
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