AMD Ryzen Embedded V2718 vs Intel Xeon E-2276M
Comparative analysis of AMD Ryzen Embedded V2718 and Intel Xeon E-2276M processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Compatibility, Peripherals, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the AMD Ryzen Embedded V2718
- CPU is newer: launch date 1 year(s) 5 month(s) later
- 2 more cores, run more applications at once: 8 vs 6
- 4 more threads: 16 vs 12
- Around 5% higher maximum core temperature: 105 °C vs 100 °C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- 2.7x more L2 cache, more data can be stored in the L2 cache for quick access later
- 699050.7x more L3 cache, more data can be stored in the L3 cache for quick access later
- 3x lower typical power consumption: 15 Watt vs 45 Watt
- Around 36% better performance in PassMark - CPU mark: 16075 vs 11808
Specifications (specs) | |
Launch date | 10 Nov 2020 vs 27 May 2019 |
Number of cores | 8 vs 6 |
Number of threads | 16 vs 12 |
Maximum core temperature | 105 °C vs 100 °C |
Manufacturing process technology | 7 nm vs 14 nm |
L1 cache | 512 KB vs 384 KB |
L2 cache | 4 MB vs 1.5 MB |
L3 cache | 8 MB vs 12 MiB |
Thermal Design Power (TDP) | 15 Watt vs 45 Watt |
Benchmarks | |
PassMark - CPU mark | 16075 vs 11808 |
Reasons to consider the Intel Xeon E-2276M
- Around 13% higher clock speed: 4.70 GHz vs 4.15 GHz
- 2x more maximum memory size: 128 GB vs 64 GB
- Around 17% better performance in PassMark - Single thread mark: 2614 vs 2240
Specifications (specs) | |
Maximum frequency | 4.70 GHz vs 4.15 GHz |
Maximum memory size | 128 GB vs 64 GB |
Benchmarks | |
PassMark - Single thread mark | 2614 vs 2240 |
Compare benchmarks
CPU 1: AMD Ryzen Embedded V2718
CPU 2: Intel Xeon E-2276M
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen Embedded V2718 | Intel Xeon E-2276M |
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PassMark - Single thread mark | 2240 | 2614 |
PassMark - CPU mark | 16075 | 11808 |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 1693 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 1693 | |
GFXBench 4.0 - Manhattan (Frames) | 3233 | |
GFXBench 4.0 - Manhattan (Fps) | 3233 | |
GFXBench 4.0 - T-Rex (Frames) | 3359 | |
GFXBench 4.0 - T-Rex (Fps) | 3359 |
Compare specifications (specs)
AMD Ryzen Embedded V2718 | Intel Xeon E-2276M | |
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Essentials |
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Architecture codename | Zen 2 | Coffee Lake |
Launch date | 10 Nov 2020 | 27 May 2019 |
OPN Tray | 100-000000242 | |
Place in performance rating | 970 | 873 |
Family | Xeon E | |
Launch price (MSRP) | $450 | |
Processor Number | E-2276M | |
Series | E-2200 | |
Vertical segment | Mobile | |
Performance |
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Base frequency | 1.7 GHz | 2.80 GHz |
L1 cache | 512 KB | 384 KB |
L2 cache | 4 MB | 1.5 MB |
L3 cache | 8 MB | 12 MiB |
Manufacturing process technology | 7 nm | 14 nm |
Maximum core temperature | 105 °C | 100 °C |
Maximum frequency | 4.15 GHz | 4.70 GHz |
Number of cores | 8 | 6 |
Number of threads | 16 | 12 |
64 bit support | ||
Bus Speed | 8 GT/s DMI | |
Unlocked | ||
Memory |
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ECC memory support | ||
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 63.58 GB/s | 41.8 GB/s |
Maximum memory size | 64 GB | 128 GB |
Supported memory types | DDR4-3200, LPDDR4x-4266 | DDR4-2666, LPDDR3-2133 |
Graphics |
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Graphics max frequency | 1600 MHz | |
iGPU core count | 7 | |
Number of pipelines | 448 | |
Processor graphics | Radeon Vega 7 | Intel UHD Graphics P630 |
Device ID | 0x3E94 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.20 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Graphics interfaces |
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DisplayPort | ||
HDMI | ||
Number of displays supported | 4 | 3 |
DVI | ||
eDP | ||
Graphics image quality |
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Max resolution over DisplayPort | 4096x2160 | 4096x2304@60Hz |
Max resolution over HDMI 1.4 | 4096x2160 | 4096x2304@30Hz |
4K resolution support | ||
Max resolution over eDP | 4096x2304@60Hz | |
Compatibility |
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Configurable TDP | 10-25 Watt | |
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FP6 | FCBGA1440 |
Thermal Design Power (TDP) | 15 Watt | 45 Watt |
Configurable TDP-down | 35 Watt | |
Peripherals |
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Max number of PCIe lanes | 20 | 16 |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | 1x16, 2x8, 1x8+2x4 | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Intel® Flex Memory Access | ||
Intel® My WiFi technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® Thermal Velocity Boost | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Speed Shift technology | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |