Intel Xeon E-2276ME processor review

Xeon E-2276ME processor released by Intel; release date: 27 May 2019. At the time of release, the processor cost $450. The processor is designed for embedded-computers and based on Coffee Lake microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 6, threads - 12. Maximum CPU clock speed - 4.50 GHz. Maximum operating temperature - 100. Manufacturing process technology - 14 nm. Cache size: L1 - 384 KB, L2 - 1.5 MB, L3 - 12 MB.

Supported memory types: DDR4-2666. Maximum memory size: 64 GB.

Supported socket types: FCBGA1440. Maximum number of processors in a configuration - 1. Power consumption (TDP): 45 Watt.

The processor has integrated graphics Intel UHD Graphics P630 with the following parameters: maximum video memory size - 64 GB.

Benchmarks

PassMark
Single thread mark

Top 1 CPU

This CPU

4765

1604

PassMark
CPU mark

Top 1 CPU

This CPU

154624

8167

Name	Value
PassMark - Single thread mark	1604
PassMark - CPU mark	8167

Integrated graphics – Intel UHD Graphics P630

Technical info
Boost clock speed	1200 MHz
Core clock speed	350 MHz
Pipelines	24

Specifications (specs)

Essentials
Architecture codename	Coffee Lake
Launch date	27 May 2019
Launch price (MSRP)	$450
Place in performance rating	1377
Processor Number	E-2276ME
Series	Intel Xeon E Processor
Status	Launched
Vertical segment	Embedded
Performance
64 bit support
Base frequency	2.80 GHz
Bus Speed	8 GT/s
L1 cache	384 KB
L2 cache	1.5 MB
L3 cache	12 MB
Manufacturing process technology	14 nm
Maximum core temperature	100
Maximum frequency	4.50 GHz
Number of cores	6
Number of threads	12

Memory
Max memory channels	2
Maximum memory size	64 GB
Supported memory types	DDR4-2666
Graphics
Device ID	0x3E94
Graphics base frequency	350 MHz
Graphics max dynamic frequency	1.15 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory	64 GB
Processor graphics	Intel UHD Graphics P630
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported	3
Graphics image quality
4K resolution support
Max resolution over DisplayPort	4096x2304@30Hz
Max resolution over eDP	4096x2304@30Hz
Graphics API support
DirectX	12
OpenGL	4.5
Compatibility
Configurable TDP-down	35 Watt
Max number of CPUs in a configuration	1
Package Size	42mm x 28mm
Sockets supported	FCBGA1440
Thermal Design Power (TDP)	45 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	3.0
PCIe configurations	Up to 1x16, 2x8, 1x8+2x4
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel SSE4.1, Intel SSE4.2, Intel AVX2
Intel 64
Intel® AES New Instructions
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Optane™ Memory Supported
Intel® Stable Image Platform Program (SIPP)
Intel® Turbo Boost technology
Speed Shift technology
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)