Intel Xeon E3-1286L v3 processor review

Intel Xeon E3-1286L v3

Xeon E3-1286L v3 processor released by Intel; release date: Q2'14. The processor is designed for server-computers and based on Haswell microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 4, threads - 8. Maximum CPU clock speed - 4.00 GHz. Manufacturing process technology - 22 nm.

Supported memory types: DDR3 and DDR3L 1333/1600 at 1.5V. Maximum memory size: 32 GB.

Supported socket types: FCLGA1150. Maximum number of processors in a configuration - 1. Power consumption (TDP): 65 Watt.

Benchmarks

PassMark
Single thread mark
Top 1 CPU
This CPU
4870
2329
PassMark
CPU mark
Top 1 CPU
This CPU
156834
6929
Name Value
PassMark - Single thread mark 2329
PassMark - CPU mark 6929

Specifications (specs)

Essentials

Architecture codename Haswell
Launch date Q2'14
Place in performance rating 1068
Processor Number E3-1286LV3
Series Intel® Xeon® Processor E3 v3 Family
Status Discontinued
Vertical segment Server

Performance

64 bit support
Base frequency 3.20 GHz
Bus Speed 5 GT/s DMI2
Manufacturing process technology 22 nm
Maximum frequency 4.00 GHz
Number of cores 4
Number of QPI Links 0
Number of threads 8

Memory

Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 32 GB
Supported memory types DDR3 and DDR3L 1333/1600 at 1.5V

Graphics

Execution Units 20
Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.25 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory 1.7 GB

Graphics interfaces

DisplayPort
eDP
HDMI
Number of displays supported 3
VGA

Graphics image quality

Max resolution over DisplayPort 3840x2160@60Hz
Max resolution over HDMI 1.4 3840x2160@60Hz
Max resolution over VGA 2880x1800@60Hz

Graphics API support

DirectX 11.2
OpenGL 4.3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 37.5mm x 37.5mm
Sockets supported FCLGA1150
Thermal Design Power (TDP) 65 Watt
Thermal Solution PCG 2013C

Peripherals

Max number of PCIe lanes 16
PCI Express revision 3.0
PCIe configurations 1x16, 2x8, 1x8/2x4
Scalability 1S Only

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)