Intel Xeon E5-2603 v2 processor review

Intel Xeon E5-2603 v2

Xeon E5-2603 v2 processor released by Intel; release date: September 2013. At the time of release, the processor cost $240. The processor is designed for server-computers and based on Ivy Bridge EP microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 4, threads - 4. Maximum CPU clock speed - 1.8 GHz. Maximum operating temperature - 71°C. Manufacturing process technology - 22 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 10240 KB (shared).

Supported memory types: DDR3 800/1066/1333. Maximum memory size: 768 GB.

Supported socket types: FCLGA2011. Maximum number of processors in a configuration - 2. Power consumption (TDP): 80 Watt.

Benchmarks

PassMark
Single thread mark
Top 1 CPU
This CPU
4765
991
PassMark
CPU mark
Top 1 CPU
This CPU
157100
5017
Geekbench 4
Single Core
Top 1 CPU
This CPU
5311
1865
Geekbench 4
Multi-Core
Top 1 CPU
This CPU
36691
5459
Name Value
PassMark - Single thread mark 991
PassMark - CPU mark 5017
Geekbench 4 - Single Core 1865
Geekbench 4 - Multi-Core 5459

Specifications (specs)

Essentials

Architecture codename Ivy Bridge EP
Launch date September 2013
Launch price (MSRP) $240
Place in performance rating 1448
Price now $39.09
Processor Number E5-2603V2
Series Intel® Xeon® Processor E5 v2 Family
Status Launched
Value for money (0-100) 28.38
Vertical segment Server

Performance

64 bit support
Base frequency 1.80 GHz
Bus Speed 6.4 GT/s QPI
Die size 160 mm
L1 cache 64 KB (per core)
L2 cache 256 KB (per core)
L3 cache 10240 KB (shared)
Manufacturing process technology 22 nm
Maximum core temperature 71°C
Maximum frequency 1.8 GHz
Number of cores 4
Number of QPI Links 2
Number of threads 4
Transistor count 1400 million
VID voltage range 0.65–1.30V

Memory

ECC memory support
Max memory channels 4
Maximum memory bandwidth 42.6 GB/s
Maximum memory size 768 GB
Supported memory types DDR3 800/1066/1333

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 2
Package Size 52.5mm x 45mm
Sockets supported FCLGA2011
Thermal Design Power (TDP) 80 Watt

Peripherals

Max number of PCIe lanes 40
PCI Express revision 3.0
PCIe configurations x4, x8, x16
Scalability 2S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 46-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)