Intel Xeon E5-2689 processor review

Xeon E5-2689 processor released by Intel; release date: 6 Mar 2012. The processor is designed for server-computers and based on Sandy Bridge microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 8, threads - 16. Maximum CPU clock speed - 3.6 GHz. Maximum operating temperature - 52°C. Manufacturing process technology - 32 nm.

Supported memory types: DDR3-800, DDR3-1066, DDR3-1333, DDR3-1600. Maximum memory size: 384 GB.

Supported socket types: LGA2011. Maximum number of processors in a configuration - 2. Power consumption (TDP): 115 Watt.

Benchmarks

CompuBench 1.5 Desktop
Face Detection
Top 1 CPU
This CPU
56.680 mPixels/s
9.219 mPixels/s
CompuBench 1.5 Desktop
Ocean Surface Simulation
Top 1 CPU
This CPU
754.248 Frames/s
123.121 Frames/s
CompuBench 1.5 Desktop
T-Rex
Top 1 CPU
This CPU
3.237 Frames/s
0.974 Frames/s
CompuBench 1.5 Desktop
Video Composition
Top 1 CPU
This CPU
49.002 Frames/s
3.868 Frames/s
CompuBench 1.5 Desktop
Bitcoin Mining
Top 1 CPU
This CPU
218.231 mHash/s
9.539 mHash/s
Name Value
CompuBench 1.5 Desktop - Face Detection 9.219 mPixels/s
CompuBench 1.5 Desktop - Ocean Surface Simulation 123.121 Frames/s
CompuBench 1.5 Desktop - T-Rex 0.974 Frames/s
CompuBench 1.5 Desktop - Video Composition 3.868 Frames/s
CompuBench 1.5 Desktop - Bitcoin Mining 9.539 mHash/s

Specifications (specs)

Essentials

Architecture codename Sandy Bridge
Launch date 6 Mar 2012
Place in performance rating 1306
Processor Number E5-2689
Vertical segment Server

Performance

64 bit support
Base frequency 2.6 GHz
Bus Speed 8 GT/s QPI
Manufacturing process technology 32 nm
Maximum core temperature 52°C
Maximum frequency 3.6 GHz
Number of cores 8
Number of QPI Links 2
Number of threads 16
VID voltage range 0.6V - 1.35V

Memory

ECC memory support
Max memory channels 4
Maximum memory bandwidth 51.2 GB/s
Maximum memory size 384 GB
Supported memory types DDR3-800, DDR3-1066, DDR3-1333, DDR3-1600

Compatibility

Max number of CPUs in a configuration 2
Sockets supported LGA2011
Thermal Design Power (TDP) 115 Watt

Peripherals

Max number of PCIe lanes 40
PCI Express revision 3.0
PCIe configurations x4, x8, x16
Scalability 2S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)