Intel Xeon E7340 vs Intel Xeon E5-2689

Comparative analysis of Intel Xeon E7340 and Intel Xeon E5-2689 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the Intel Xeon E7340

  • Around 27% higher maximum core temperature: 66°C vs 52°C
  • Around 44% lower typical power consumption: 80 Watt vs 115 Watt
Maximum core temperature 66°C vs 52°C
Thermal Design Power (TDP) 80 Watt vs 115 Watt

Reasons to consider the Intel Xeon E5-2689

  • 4 more cores, run more applications at once: 8 vs 4
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Number of cores 8 vs 4
Manufacturing process technology 32 nm vs 65 nm

Compare benchmarks

CPU 1: Intel Xeon E7340
CPU 2: Intel Xeon E5-2689

Name Intel Xeon E7340 Intel Xeon E5-2689
PassMark - Single thread mark 960
PassMark - CPU mark 6544
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 9.219
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 123.121
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.974
CompuBench 1.5 Desktop - Video Composition (Frames/s) 3.868
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 9.539

Compare specifications (specs)

Intel Xeon E7340 Intel Xeon E5-2689

Essentials

Architecture codename Tigerton Sandy Bridge
Launch date Q3'07 6 Mar 2012
Place in performance rating 2150 2151
Processor Number E7340 E5-2689
Series Legacy Intel Xeon Processors
Vertical segment Server Server

Performance

64 bit support
Base frequency 2.40 GHz 2.6 GHz
Bus Speed 1066 MHz 8 GT/s QPI
Die size 286 mm2
L3 cache 8 MB L2 Cache
Manufacturing process technology 65 nm 32 nm
Maximum core temperature 66°C 52°C
Number of cores 4 8
Transistor count 582 million
VID voltage range 1.0V-1.5V 0.6V - 1.35V
Maximum frequency 3.6 GHz
Number of QPI Links 2
Number of threads 16

Compatibility

Package Size 53.3mm x 53.3mm
Sockets supported PGA604, PPGA604 LGA2011
Thermal Design Power (TDP) 80 Watt 115 Watt
Max number of CPUs in a configuration 2

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

Memory

ECC memory support
Max memory channels 4
Maximum memory bandwidth 51.2 GB/s
Maximum memory size 384 GB
Supported memory types DDR3-800, DDR3-1066, DDR3-1333, DDR3-1600

Peripherals

Max number of PCIe lanes 40
PCI Express revision 3.0
PCIe configurations x4, x8, x16
Scalability 2S