Intel Xeon E7340 vs Intel Xeon E5-2689

Comparative analysis of Intel Xeon E7340 and Intel Xeon E5-2689 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

Intel Xeon E7340

Intel Xeon E5-2689

Differences

Reasons to consider the Intel Xeon E7340

Around 27% higher maximum core temperature: 66°C vs 52°C
Around 44% lower typical power consumption: 80 Watt vs 115 Watt

Maximum core temperature	66°C vs 52°C
Thermal Design Power (TDP)	80 Watt vs 115 Watt

Reasons to consider the Intel Xeon E5-2689

4 more cores, run more applications at once: 8 vs 4
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm

Number of cores	8 vs 4
Manufacturing process technology	32 nm vs 65 nm

Compare benchmarks

CPU 1: Intel Xeon E7340
CPU 2: Intel Xeon E5-2689

Name	Intel Xeon E7340	Intel Xeon E5-2689
PassMark - Single thread mark	960
PassMark - CPU mark	6544
CompuBench 1.5 Desktop - Face Detection (mPixels/s)		9.219
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)		123.121
CompuBench 1.5 Desktop - T-Rex (Frames/s)		0.974
CompuBench 1.5 Desktop - Video Composition (Frames/s)		3.868
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)		9.539

Compare specifications (specs)

	Intel Xeon E7340	Intel Xeon E5-2689
Essentials
Architecture codename	Tigerton	Sandy Bridge
Launch date	Q3'07	6 Mar 2012
Place in performance rating	2139	2142
Processor Number	E7340	E5-2689
Series	Legacy Intel Xeon Processors
Vertical segment	Server	Server
Performance
64 bit support
Base frequency	2.40 GHz	2.6 GHz
Bus Speed	1066 MHz	8 GT/s QPI
Die size	286 mm2
L3 cache	8 MB L2 Cache
Manufacturing process technology	65 nm	32 nm
Maximum core temperature	66°C	52°C
Number of cores	4	8
Transistor count	582 million
VID voltage range	1.0V-1.5V	0.6V - 1.35V
Maximum frequency		3.6 GHz
Number of QPI Links		2
Number of threads		16
Compatibility
Package Size	53.3mm x 53.3mm
Sockets supported	PGA604, PPGA604	LGA2011
Thermal Design Power (TDP)	80 Watt	115 Watt
Max number of CPUs in a configuration		2
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Memory
ECC memory support
Max memory channels		4
Maximum memory bandwidth		51.2 GB/s
Maximum memory size		384 GB
Supported memory types		DDR3-800, DDR3-1066, DDR3-1333, DDR3-1600
Peripherals
Max number of PCIe lanes		40
PCI Express revision		3.0
PCIe configurations		x4, x8, x16
Scalability		2S