Intel Xeon W-1370P processor review

Xeon W-1370P processor released by Intel; release date: 1 Apr 2021. At the time of release, the processor cost $428 - $431. The processor is designed for workstation-computers and based on Rocket Lake microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 8, threads - 16. Maximum CPU clock speed - 5.20 GHz. Maximum operating temperature - 100°C. Manufacturing process technology - 14 nm. Cache size: L3 - 16 MB.

Supported memory types: DDR4-3200. Maximum memory size: 128 GB.

Supported socket types: FCLGA1200. Maximum number of processors in a configuration - 1. Power consumption (TDP): 125 Watt.

The processor has integrated graphics Intel UHD Graphics P750 with the following parameters: maximum video memory size - 64 GB.

Benchmarks

PassMark
Single thread mark
Top 1 CPU
This CPU
3781
3494
PassMark
CPU mark
Top 1 CPU
This CPU
87767
25202
Name Value
PassMark - Single thread mark 3494
PassMark - CPU mark 25202

Integrated graphics – Intel UHD Graphics P750

Technical info

Boost clock speed 900 MHz
Compute units 32
Core clock speed 300 MHz
Manufacturing process technology 14 nm
Peak Double Precision (FP64) Performance 115.2 GFLOPS (1:4)
Peak Half Precision (FP16) Performance 921.6 GFLOPS (2:1)
Peak Single Precision (FP32) Performance 460.8 GFLOPS
Pipelines 256
Pixel fill rate 28.80 GPixel/s
Texture fill rate 57.60 GTexel/s
Thermal Design Power (TDP) 15 Watt

Specifications (specs)

Essentials

Architecture codename Rocket Lake
Launch date 1 Apr 2021
Launch price (MSRP) $428 - $431
Place in performance rating 48
Processor Number W-1370P
Series Intel Xeon W Processor
Status Launched
Vertical segment Workstation

Performance

64 bit support
Base frequency 3.60 GHz
Bus Speed 8 GT/s
L3 cache 16 MB
Manufacturing process technology 14 nm
Maximum core temperature 100°C
Maximum frequency 5.20 GHz
Number of cores 8
Number of threads 16

Memory

Max memory channels 2
Maximum memory bandwidth 50 GB/s
Maximum memory size 128 GB
Supported memory types DDR4-3200

Graphics

Device ID 0x4C90
Execution Units 32
Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.30 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory 64 GB
Processor graphics Intel UHD Graphics P750

Graphics interfaces

Number of displays supported 3

Graphics image quality

4K resolution support
Max resolution over DisplayPort 5120 x 3200 @60Hz
Max resolution over eDP 5120 x 3200 @60Hz

Graphics API support

DirectX 12.1
OpenGL 4.5

Compatibility

Configurable TDP-down 95 Watt
Configurable TDP-down Frequency 3.10 GHz
Max number of CPUs in a configuration 1
Package Size 37.5 mm x 37.5 mm
Sockets supported FCLGA1200
Thermal Design Power (TDP) 125 Watt
Thermal Solution PCG 2019A

Peripherals

Max number of PCIe lanes 20
PCI Express revision 4.0
PCIe configurations Up to 1x16+1x4, 2x8+1x4, 1x8+3x4
Scalability 1S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Thermal Velocity Boost
Intel® Turbo Boost technology
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)