Intel Xeon W-1370P processor review

Xeon W-1370P processor released by Intel; release date: 1 Apr 2021. At the time of release, the processor cost $428 - $431. The processor is designed for workstation-computers and based on Rocket Lake microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 8, threads - 16. Maximum CPU clock speed - 5.20 GHz. Maximum operating temperature - 100°C. Manufacturing process technology - 14 nm. Cache size: L3 - 16 MB.

Supported memory types: DDR4-3200. Maximum memory size: 128 GB.

Supported socket types: FCLGA1200. Maximum number of processors in a configuration - 1. Power consumption (TDP): 125 Watt.

The processor has integrated graphics Intel UHD Graphics P750 with the following parameters: maximum video memory size - 64 GB.

Benchmarks

PassMark
Single thread mark

Top 1 CPU

This CPU

4871

3479

PassMark
CPU mark

Top 1 CPU

This CPU

156834

23306

Name	Value
PassMark - Single thread mark	3479
PassMark - CPU mark	23306

Integrated graphics – Intel UHD Graphics P750

Technical info
Boost clock speed	900 MHz
Compute units	32
Core clock speed	300 MHz
Manufacturing process technology	14 nm
Peak Double Precision (FP64) Performance	115.2 GFLOPS (1:4)
Peak Half Precision (FP16) Performance	921.6 GFLOPS (2:1)
Peak Single Precision (FP32) Performance	460.8 GFLOPS
Pipelines	256
Pixel fill rate	28.80 GPixel/s
Texture fill rate	57.60 GTexel/s
Thermal Design Power (TDP)	15 Watt

Specifications (specs)

Essentials
Architecture codename	Rocket Lake
Launch date	1 Apr 2021
Launch price (MSRP)	$428 - $431
Place in performance rating	348
Processor Number	W-1370P
Series	Intel Xeon W Processor
Status	Launched
Vertical segment	Workstation
Performance
64 bit support
Base frequency	3.60 GHz
Bus Speed	8 GT/s
L3 cache	16 MB
Manufacturing process technology	14 nm
Maximum core temperature	100°C
Maximum frequency	5.20 GHz
Number of cores	8
Number of threads	16

Memory
Max memory channels	2
Maximum memory bandwidth	50 GB/s
Maximum memory size	128 GB
Supported memory types	DDR4-3200
Graphics
Device ID	0x4C90
Execution Units	32
Graphics base frequency	350 MHz
Graphics max dynamic frequency	1.30 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory	64 GB
Processor graphics	Intel UHD Graphics P750
Graphics interfaces
Number of displays supported	3
Graphics image quality
4K resolution support
Max resolution over DisplayPort	5120 x 3200 @60Hz
Max resolution over eDP	5120 x 3200 @60Hz
Graphics API support
DirectX	12.1
OpenGL	4.5
Compatibility
Configurable TDP-down	95 Watt
Configurable TDP-down Frequency	3.10 GHz
Max number of CPUs in a configuration	1
Package Size	37.5 mm x 37.5 mm
Sockets supported	FCLGA1200
Thermal Design Power (TDP)	125 Watt
Thermal Solution	PCG 2019A
Peripherals
Max number of PCIe lanes	20
PCI Express revision	4.0
PCIe configurations	Up to 1x16+1x4, 2x8+1x4, 1x8+3x4
Scalability	1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Thermal Velocity Boost
Intel® Turbo Boost technology
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)