AMD A4-3305M vs AMD Athlon Neo X2 L325

Comparative analysis of AMD A4-3305M and AMD Athlon Neo X2 L325 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Virtualization, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD A4-3305M

AMD Athlon Neo X2 L325

Differences

Reasons to consider the AMD A4-3305M

CPU is newer: launch date 2 year(s) 2 month(s) later
Around 67% higher clock speed: 2.5 GHz vs 1.5 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Around 46% better performance in PassMark - Single thread mark: 830 vs 567
Around 35% better performance in PassMark - CPU mark: 751 vs 556

Specifications (specs)
Launch date	8 December 2011 vs 10 September 2009
Maximum frequency	2.5 GHz vs 1.5 GHz
Manufacturing process technology	32 nm vs 65 nm
Benchmarks
PassMark - Single thread mark	830 vs 567
PassMark - CPU mark	751 vs 556

Reasons to consider the AMD Athlon Neo X2 L325

Around 94% lower typical power consumption: 18 Watt vs 35 Watt

Thermal Design Power (TDP)	18 Watt vs 35 Watt

Compare benchmarks

CPU 1: AMD A4-3305M
CPU 2: AMD Athlon Neo X2 L325

PassMark - Single thread mark

CPU 1

CPU 2

830

567

PassMark - CPU mark

CPU 1

CPU 2

751

556

Name	AMD A4-3305M	AMD Athlon Neo X2 L325
PassMark - Single thread mark	830	567
PassMark - CPU mark	751	556
Geekbench 4 - Single Core	277
Geekbench 4 - Multi-Core	478

Compare specifications (specs)

	AMD A4-3305M	AMD Athlon Neo X2 L325
Essentials
Architecture codename	Llano	Congo
Launch date	8 December 2011	10 September 2009
Place in performance rating	2873	2878
Series	AMD A-Series	2x AMD Athlon Neo
Vertical segment	Laptop	Laptop
Performance
64 bit support
Die size	226 mm
L1 cache	256 KB
L2 cache	1024 KB	1024 KB
Manufacturing process technology	32 nm	65 nm
Maximum frequency	2.5 GHz	1.5 GHz
Number of cores	2	2
Number of threads	2	2
Transistor count	1000 Million
Front-side bus (FSB)		1600 MHz
Maximum core temperature		95 °C
Memory
Supported memory types	DDR3
Compatibility
Max number of CPUs in a configuration	1
Sockets supported	FS1	ASB1
Thermal Design Power (TDP)	35 Watt	18 Watt
Virtualization
AMD Virtualization (AMD-V™)
Advanced Technologies
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