AMD A4-3330MX vs AMD Mobile Sempron SI-40

Comparative analysis of AMD A4-3330MX and AMD Mobile Sempron SI-40 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD A4-3330MX

AMD Mobile Sempron SI-40

Differences

Reasons to consider the AMD A4-3330MX

CPU is newer: launch date 3 year(s) 5 month(s) later
1 more cores, run more applications at once: 2 vs 1
1 more threads: 2 vs 1
Around 30% higher clock speed: 2.6 GHz vs 2 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
4x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 44% better performance in PassMark - Single thread mark: 908 vs 631
2.6x better performance in PassMark - CPU mark: 756 vs 288

Specifications (specs)
Launch date	8 December 2011 vs 4 July 2008
Number of cores	2 vs 1
Number of threads	2 vs 1
Maximum frequency	2.6 GHz vs 2 GHz
Manufacturing process technology	32 nm vs 65 nm
L2 cache	2048 KB vs 512 KB
Benchmarks
PassMark - Single thread mark	908 vs 631
PassMark - CPU mark	756 vs 288

Reasons to consider the AMD Mobile Sempron SI-40

Around 80% lower typical power consumption: 25 Watt vs 45 Watt

Thermal Design Power (TDP)	25 Watt vs 45 Watt

Compare benchmarks

CPU 1: AMD A4-3330MX
CPU 2: AMD Mobile Sempron SI-40

PassMark - Single thread mark

CPU 1

CPU 2

908

631

PassMark - CPU mark

CPU 1

CPU 2

756

288

Name	AMD A4-3330MX	AMD Mobile Sempron SI-40
PassMark - Single thread mark	908	631
PassMark - CPU mark	756	288
Geekbench 4 - Single Core	252
Geekbench 4 - Multi-Core	449

Compare specifications (specs)

	AMD A4-3330MX	AMD Mobile Sempron SI-40
Essentials
Architecture codename	Llano	Sable
Launch date	8 December 2011	4 July 2008
Place in performance rating	2832	2805
Series	AMD A-Series	AMD Mobile Sempron
Vertical segment	Laptop	Laptop
Performance
64 bit support
Die size	226 mm
L1 cache	256 KB
L2 cache	2048 KB	512 KB
Manufacturing process technology	32 nm	65 nm
Maximum frequency	2.6 GHz	2 GHz
Number of cores	2	1
Number of threads	2	1
Transistor count	1000 Million
Front-side bus (FSB)		1800 MHz
Maximum core temperature		100 °C
Memory
Supported memory types	DDR3
Compatibility
Max number of CPUs in a configuration	1
Sockets supported	FS1	S1g2
Thermal Design Power (TDP)	45 Watt	25 Watt
Virtualization
AMD Virtualization (AMD-V™)