AMD A4-5050 vs AMD Mobile Sempron 3300+

Comparative analysis of AMD A4-5050 and AMD Mobile Sempron 3300+ processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD A4-5050

AMD Mobile Sempron 3300+

Differences

Reasons to consider the AMD A4-5050

CPU is newer: launch date 8 year(s) 8 month(s) later
3 more cores, run more applications at once: 4 vs 1
3 more threads: 4 vs 1
A newer manufacturing process allows for a more powerful, yet cooler running processor: 28 nm vs 90 nm
16x more L2 cache, more data can be stored in the L2 cache for quick access later
4.4x lower typical power consumption: 13.5 Watt vs 62 / 25 Watt
3x better performance in PassMark - CPU mark: 1328 vs 445

Specifications (specs)
Launch date	1 February 2014 vs 1 June 2005
Number of cores	4 vs 1
Number of threads	4 vs 1
Manufacturing process technology	28 nm vs 90 nm
L2 cache	2 MB vs 128 KB
Thermal Design Power (TDP)	13.5 Watt vs 62 / 25 Watt
Benchmarks
PassMark - CPU mark	1328 vs 445

Reasons to consider the AMD Mobile Sempron 3300+

Around 29% higher clock speed: 2 GHz vs 1.55 GHz
Around 7% better performance in PassMark - Single thread mark: 574 vs 538

Specifications (specs)
Maximum frequency	2 GHz vs 1.55 GHz
Benchmarks
PassMark - Single thread mark	574 vs 538

Compare benchmarks

CPU 1: AMD A4-5050
CPU 2: AMD Mobile Sempron 3300+

PassMark - Single thread mark

CPU 1

CPU 2

538

574

PassMark - CPU mark

CPU 1

CPU 2

1328

445

Name	AMD A4-5050	AMD Mobile Sempron 3300+
PassMark - Single thread mark	538	574
PassMark - CPU mark	1328	445

Compare specifications (specs)

	AMD A4-5050	AMD Mobile Sempron 3300+
Essentials
Architecture codename	Kabini	Roma
Launch date	1 February 2014	1 June 2005
Place in performance rating	2888	2884
Series	AMD A-Series	AMD Mobile Sempron
Vertical segment	Laptop	Laptop
Performance
64 bit support
Die size	246 mm
L1 cache	256 KB
L2 cache	2 MB	128 KB
Manufacturing process technology	28 nm	90 nm
Maximum case temperature (TCase)	90 °C
Maximum frequency	1.55 GHz	2 GHz
Number of cores	4	1
Number of threads	4	1
Transistor count	1178 million
Front-side bus (FSB)		800 MHz
Memory
Supported memory types	DDR3
Compatibility
Max number of CPUs in a configuration	1
Sockets supported	FT3	745
Thermal Design Power (TDP)	13.5 Watt	62 / 25 Watt
Advanced Technologies
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Virtualization
AMD Virtualization (AMD-V™)