AMD EPYC 3451 vs AMD EPYC 7302P
Comparative analysis of AMD EPYC 3451 and AMD EPYC 7302P processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD EPYC 3451
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 55% lower typical power consumption: 100 Watt vs 155 Watt
L1 cache | 96K (per core) vs 1 MB |
Thermal Design Power (TDP) | 100 Watt vs 155 Watt |
Reasons to consider the AMD EPYC 7302P
- CPU is newer: launch date 1 year(s) 5 month(s) later
- Around 10% higher clock speed: 3.3 GHz vs 3 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm, 14 nm vs 14 nm
- 4194304x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 10% better performance in PassMark - Single thread mark: 1870 vs 1700
- Around 67% better performance in PassMark - CPU mark: 32612 vs 19532
Specifications (specs) | |
Launch date | 7 Aug 2019 vs 21 Feb 2018 |
Maximum frequency | 3.3 GHz vs 3 GHz |
Manufacturing process technology | 7 nm, 14 nm vs 14 nm |
L3 cache | 128 MB vs 32MB (shared) |
Benchmarks | |
PassMark - Single thread mark | 1870 vs 1700 |
PassMark - CPU mark | 32612 vs 19532 |
Compare benchmarks
CPU 1: AMD EPYC 3451
CPU 2: AMD EPYC 7302P
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD EPYC 3451 | AMD EPYC 7302P |
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PassMark - Single thread mark | 1700 | 1870 |
PassMark - CPU mark | 19532 | 32612 |
Compare specifications (specs)
AMD EPYC 3451 | AMD EPYC 7302P | |
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Essentials |
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Architecture codename | Zen (Snowy Owl) | Zen 2 |
Launch date | 21 Feb 2018 | 7 Aug 2019 |
Place in performance rating | 1091 | 805 |
Launch price (MSRP) | $825 | |
OPN PIB | 100-100000049WOF | |
OPN Tray | 100-000000049 | |
Vertical segment | Server | |
Performance |
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Base frequency | 2.15 GHz | 3.0 GHz |
Die size | 2x 213 mm² | |
L1 cache | 96K (per core) | 1 MB |
L2 cache | 512K (per core) | 8 MB |
L3 cache | 32MB (shared) | 128 MB |
Manufacturing process technology | 14 nm | 7 nm, 14 nm |
Maximum core temperature | 105°C | |
Maximum frequency | 3 GHz | 3.3 GHz |
Number of cores | 16 | 16 |
Number of threads | 32 | 32 |
Transistor count | 4,800 million | |
Unlocked | ||
Memory |
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ECC memory support | ||
Supported memory types | DDR4-2666 MHz, Dual-channel | DDR4-3200 |
Max memory channels | 8 | |
Maximum memory bandwidth | 190.7 GB/s | |
Maximum memory size | 4 TB | |
Compatibility |
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Configurable TDP | 80-100 W | |
Max number of CPUs in a configuration | 1 | |
Sockets supported | AMD BGA SP4r2 | SP3 |
Thermal Design Power (TDP) | 100 Watt | 155 Watt |
Socket Count | 1P | |
Peripherals |
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PCIe configurations | Gen 3, 64 Lanes, (CPU only) | x16, x8 |
Max number of PCIe lanes | 128 | |
PCI Express revision | 4.0 | |
Advanced Technologies |
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AMD SenseMI | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Virtualization |
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AMD Virtualization (AMD-V™) |