AMD EPYC 3451 vs Intel Xeon D-1732TE

Comparative analysis of AMD EPYC 3451 and Intel Xeon D-1732TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD EPYC 3451

Intel Xeon D-1732TE

Differences

Reasons to consider the AMD EPYC 3451

8 more cores, run more applications at once: 16 vs 8
16 more threads: 32 vs 16
Around 37% better performance in PassMark - CPU mark: 19532 vs 14254

Specifications (specs)
Number of cores	16 vs 8
Number of threads	32 vs 16
Benchmarks
PassMark - CPU mark	19532 vs 14254

Reasons to consider the Intel Xeon D-1732TE

A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 14 nm
491520x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 92% lower typical power consumption: 52 Watt vs 100 Watt
Around 19% better performance in PassMark - Single thread mark: 2015 vs 1700

Specifications (specs)
Manufacturing process technology	10 nm vs 14 nm
L3 cache	15 MB vs 32MB (shared)
Thermal Design Power (TDP)	52 Watt vs 100 Watt
Benchmarks
PassMark - Single thread mark	2015 vs 1700

Compare benchmarks

CPU 1: AMD EPYC 3451
CPU 2: Intel Xeon D-1732TE

PassMark - Single thread mark

CPU 1

CPU 2

1700

2015

PassMark - CPU mark

CPU 1

CPU 2

19532

14254

Name	AMD EPYC 3451	Intel Xeon D-1732TE
PassMark - Single thread mark	1700	2015
PassMark - CPU mark	19532	14254

Compare specifications (specs)

	AMD EPYC 3451	Intel Xeon D-1732TE
Essentials
Architecture codename	Zen (Snowy Owl)	Ice Lake
Launch date	21 Feb 2018	Q1'22
Place in performance rating	1088	1012
Launch price (MSRP)		$759
Processor Number		D-1732TE
Series		Intel Xeon D Processor
Vertical segment		Server
Performance
Base frequency	2.15 GHz	1.90 GHz
Die size	2x 213 mm²
L1 cache	96K (per core)
L2 cache	512K (per core)
L3 cache	32MB (shared)	15 MB
Manufacturing process technology	14 nm	10 nm
Maximum core temperature	105°C
Maximum frequency	3 GHz	3.00 GHz
Number of cores	16	8
Number of threads	32	16
Transistor count	4,800 million
Unlocked
64 bit support
Memory
ECC memory support
Supported memory types	DDR4-2666 MHz, Dual-channel	DDR4
Maximum memory size		384 GB
Supported memory frequency		2667 MHz
Compatibility
Configurable TDP	80-100 W
Max number of CPUs in a configuration	1
Sockets supported	AMD BGA SP4r2	FCBGA2227
Thermal Design Power (TDP)	100 Watt	52 Watt
Package Size		45mm x 45mm
Peripherals
PCIe configurations	Gen 3, 64 Lanes, (CPU only)
Integrated LAN
Max number of PCIe lanes		16
Max number of SATA 6 Gb/s Ports		24
Number of USB ports		4
PCI Express revision		4.0
Scalability		1S Only
USB revision		3.0
Security & Reliability
Execute Disable Bit (EDB)
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Advanced Technologies
Enhanced Intel SpeedStep® technology
Instruction set extensions		Intel AVX-512
Integrated Intel® QuickAssist Technology
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Number of AVX-512 FMA Units		1
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)