AMD Ryzen 7 7735H vs Intel Xeon E5-2618L v3
Comparative analysis of AMD Ryzen 7 7735H and Intel Xeon E5-2618L v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Ryzen 7 7735H
- Around 40% higher clock speed: 4.75 GHz vs 3.40 GHz
- Around 9% higher maximum core temperature: 95°C vs 87.025°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 22 nm
- 2.1x lower typical power consumption: 35 Watt vs 75 Watt
- Around 71% better performance in PassMark - Single thread mark: 3280 vs 1917
- 2.1x better performance in PassMark - CPU mark: 23950 vs 11181
Specifications (specs) | |
Maximum frequency | 4.75 GHz vs 3.40 GHz |
Maximum core temperature | 95°C vs 87.025°C |
Manufacturing process technology | 6 nm vs 22 nm |
Thermal Design Power (TDP) | 35 Watt vs 75 Watt |
Benchmarks | |
PassMark - Single thread mark | 3280 vs 1917 |
PassMark - CPU mark | 23950 vs 11181 |
Reasons to consider the Intel Xeon E5-2618L v3
Max number of CPUs in a configuration | 2 vs 1 |
Compare benchmarks
CPU 1: AMD Ryzen 7 7735H
CPU 2: Intel Xeon E5-2618L v3
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Ryzen 7 7735H | Intel Xeon E5-2618L v3 |
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PassMark - Single thread mark | 3280 | 1917 |
PassMark - CPU mark | 23950 | 11181 |
Geekbench 4 - Single Core | 3682 | |
Geekbench 4 - Multi-Core | 18932 |
Compare specifications (specs)
AMD Ryzen 7 7735H | Intel Xeon E5-2618L v3 | |
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Essentials |
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Architecture codename | Zen 3+ | Haswell |
Launch date | 4 Jan 2023 | Q3'14 |
Place in performance rating | 403 | 387 |
Processor Number | E5-2618LV3 | |
Series | Intel® Xeon® Processor E5 v3 Family | |
Status | Launched | |
Vertical segment | Embedded | |
Performance |
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Base frequency | 3.2 GHz | 2.30 GHz |
Die size | 208 mm² | |
L1 cache | 64K (per core) | |
L2 cache | 512K (per core) | |
L3 cache | 16MB (shared) | |
Manufacturing process technology | 6 nm | 22 nm |
Maximum core temperature | 95°C | 87.025°C |
Maximum frequency | 4.75 GHz | 3.40 GHz |
Number of cores | 8 | 8 |
Number of threads | 16 | 16 |
Unlocked | ||
64 bit support | ||
Bus Speed | 8 GT/s QPI | |
Number of QPI Links | 2 | |
VID voltage range | 0.65V–1.30V | |
Memory |
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ECC memory support | ||
Supported memory types | DDR5-4800 MHz, Dual-channel | DDR4 1600/1866 |
Max memory channels | 4 | |
Maximum memory bandwidth | 59 GB/s | |
Maximum memory size | 768 GB | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 2 |
Sockets supported | FP7 | FCLGA2011-3 |
Thermal Design Power (TDP) | 35 Watt | 75 Watt |
Low Halogen Options Available | ||
Package Size | 52.5mm x 45mm | |
Peripherals |
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PCIe configurations | Gen 4, 20 Lanes, (CPU only) | x4, x8, x16 |
Max number of PCIe lanes | 40 | |
PCI Express revision | 3.0 | |
Scalability | 2S | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 46-bit | |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |