AMD Ryzen 7 7745HX vs AMD Ryzen 7 7735HS

Comparative analysis of AMD Ryzen 7 7745HX and AMD Ryzen 7 7735HS processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

AMD Ryzen 7 7745HX

AMD Ryzen 7 7735HS

Differences

Reasons to consider the AMD Ryzen 7 7745HX

Processor is unlocked, an unlocked multiplier allows for easier overclocking
Around 7% higher clock speed: 5.1 GHz vs 4.75 GHz
Around 5% higher maximum core temperature: 100°C vs 95 °C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 6 nm
Around 19% better performance in PassMark - Single thread mark: 3950 vs 3312
Around 40% better performance in PassMark - CPU mark: 32642 vs 23364

Specifications (specs)
Unlocked	Unlocked vs Locked
Maximum frequency	5.1 GHz vs 4.75 GHz
Maximum core temperature	100°C vs 95 °C
Manufacturing process technology	5 nm vs 6 nm
Benchmarks
PassMark - Single thread mark	3950 vs 3312
PassMark - CPU mark	32642 vs 23364

Reasons to consider the AMD Ryzen 7 7735HS

524288x more L2 cache, more data can be stored in the L2 cache for quick access later
524288x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 57% lower typical power consumption: 35 Watt vs 55 Watt

L2 cache	4 MB vs 1MB (per core)
L3 cache	16 MB vs 32MB (shared)
Thermal Design Power (TDP)	35 Watt vs 55 Watt

Compare benchmarks

CPU 1: AMD Ryzen 7 7745HX
CPU 2: AMD Ryzen 7 7735HS

PassMark - Single thread mark

CPU 1

CPU 2

3950

3312

PassMark - CPU mark

CPU 1

CPU 2

32642

23364

Name	AMD Ryzen 7 7745HX	AMD Ryzen 7 7735HS
PassMark - Single thread mark	3950	3312
PassMark - CPU mark	32642	23364
3DMark Fire Strike - Physics Score		6890

Compare specifications (specs)

	AMD Ryzen 7 7745HX	AMD Ryzen 7 7735HS
Essentials
Architecture codename	Zen 4 (Dragon Range)	Zen 3+
Launch date	4 Jan 2023	4 Jan 2023
Place in performance rating	151	594
Vertical segment		Mobile
Performance
Base frequency	3.6 GHz	3.2 GHz
Die size	71 mm²	208 mm²
L1 cache	64K (per core)	512 KB
L2 cache	1MB (per core)	4 MB
L3 cache	32MB (shared)	16 MB
Manufacturing process technology	5 nm	6 nm
Maximum core temperature	100°C	95 °C
Maximum frequency	5.1 GHz	4.75 GHz
Number of cores	8	8
Number of threads	16	16
Transistor count	6,570 million
Unlocked
64 bit support
Memory
ECC memory support
Supported memory types	DDR5-5200 MHz, Dual-channel	DDR5-4800
Max memory channels		2
Compatibility
Configurable TDP	45-75 Watt	35-54 Watt
Max number of CPUs in a configuration	1	1
Sockets supported	FL1	FP7
Thermal Design Power (TDP)	55 Watt	35 Watt
Peripherals
PCIe configurations	Gen 5, 28 Lanes, (CPU only)
Max number of PCIe lanes		20
Number of USB ports		4.0
Graphics
Graphics base frequency		2200 MHz
Graphics interfaces
DisplayPort
HDMI
Advanced Technologies
Enhanced Virus Protection (EVP)
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Virtualization
AMD Virtualization (AMD-V™)