AMD Athlon XP 3100+ vs Intel Pentium 4 1.80

Comparative analysis of AMD Athlon XP 3100+ and Intel Pentium 4 1.80 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Athlon XP 3100+

  • CPU is newer: launch date 2 year(s) 3 month(s) later
  • Around 22% higher clock speed: 2.2 GHz vs 1.8 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 130 nm vs 180 nm
  • 16x more L1 cache, more data can be stored in the L1 cache for quick access later
  • Around 76% better performance in PassMark - CPU mark: 282 vs 160
Specifications (specs)
Launch date December 2003 vs August 2001
Maximum frequency 2.2 GHz vs 1.8 GHz
Manufacturing process technology 130 nm vs 180 nm
L1 cache 128 KB vs 8 KB
Benchmarks
PassMark - Single thread mark 431 vs 429
PassMark - CPU mark 282 vs 160

Reasons to consider the Intel Pentium 4 1.80

  • Around 1% lower typical power consumption: 66.7 Watt vs 68 Watt
Thermal Design Power (TDP) 66.7 Watt vs 68 Watt

Compare benchmarks

CPU 1: AMD Athlon XP 3100+
CPU 2: Intel Pentium 4 1.80

PassMark - Single thread mark
CPU 1
CPU 2
431
429
PassMark - CPU mark
CPU 1
CPU 2
282
160
Name AMD Athlon XP 3100+ Intel Pentium 4 1.80
PassMark - Single thread mark 431 429
PassMark - CPU mark 282 160

Compare specifications (specs)

AMD Athlon XP 3100+ Intel Pentium 4 1.80

Essentials

Architecture codename Thorton Willamette
Launch date December 2003 August 2001
Place in performance rating 3103 3105
Vertical segment Desktop Desktop
Series Legacy Intel® Pentium® Processor
Status Discontinued

Performance

L1 cache 128 KB 8 KB
L2 cache 256 KB 256 KB
Manufacturing process technology 130 nm 180 nm
Maximum frequency 2.2 GHz 1.8 GHz
Number of cores 1 1
Transistor count 63 million 42 million
64 bit support
Base frequency 1.80 GHz
Bus Speed 400 MHz FSB
Die size 217 mm2
Maximum case temperature (TCase) 78 °C
Maximum core temperature 78°C
VID voltage range 1.575V-1.75V

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported A PPGA478, PPGA423
Thermal Design Power (TDP) 68 Watt 66.7 Watt
Low Halogen Options Available
Package Size 53.3mm x 53.3mm

Memory

Supported memory types DDR1, DDR2

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology

Virtualization

Intel® Virtualization Technology (VT-x)