AMD E1-1500 vs AMD Mobile Sempron 200U

Comparative analysis of AMD E1-1500 and AMD Mobile Sempron 200U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD E1-1500

  • CPU is newer: launch date 3 year(s) 11 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • 1 more threads: 2 vs 1
  • Around 48% higher clock speed: 1.48 GHz vs 1 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 40 nm vs 65 nm
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 47% better performance in PassMark - Single thread mark: 458 vs 311
  • 3.2x better performance in PassMark - CPU mark: 398 vs 125
Specifications (specs)
Launch date 1 January 2013 vs 16 January 2009
Number of cores 2 vs 1
Number of threads 2 vs 1
Maximum frequency 1.48 GHz vs 1 GHz
Manufacturing process technology 40 nm vs 65 nm
L2 cache 1024 KB vs 256 KB
Benchmarks
PassMark - Single thread mark 458 vs 311
PassMark - CPU mark 398 vs 125

Reasons to consider the AMD Mobile Sempron 200U

  • 2.3x lower typical power consumption: 8 Watt vs 18 Watt
Thermal Design Power (TDP) 8 Watt vs 18 Watt

Compare benchmarks

CPU 1: AMD E1-1500
CPU 2: AMD Mobile Sempron 200U

PassMark - Single thread mark
CPU 1
CPU 2
458
311
PassMark - CPU mark
CPU 1
CPU 2
398
125
Name AMD E1-1500 AMD Mobile Sempron 200U
PassMark - Single thread mark 458 311
PassMark - CPU mark 398 125
Geekbench 4 - Single Core 125
Geekbench 4 - Multi-Core 221

Compare specifications (specs)

AMD E1-1500 AMD Mobile Sempron 200U

Essentials

Architecture codename Zacate Huron
Launch date 1 January 2013 16 January 2009
Place in performance rating 3235 3239
Series AMD E-Series AMD Mobile Sempron
Vertical segment Laptop Laptop

Performance

64 bit support
Die size 75 mm
L1 cache 128 KB
L2 cache 1024 KB 256 KB
Manufacturing process technology 40 nm 65 nm
Maximum case temperature (TCase) 100 °C
Maximum frequency 1.48 GHz 1 GHz
Number of cores 2 1
Number of threads 2 1
Front-side bus (FSB) 1600 MHz

Memory

Supported memory types DDR3

Compatibility

Max number of CPUs in a configuration 1
Sockets supported FT1 BGA 413-Ball ASB1
Thermal Design Power (TDP) 18 Watt 8 Watt

Advanced Technologies

PowerNow

Virtualization

AMD Virtualization (AMD-V™)