AMD EPYC 7643 vs Intel Xeon Platinum 8170

Comparative analysis of AMD EPYC 7643 and Intel Xeon Platinum 8170 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD EPYC 7643

  • 22 more cores, run more applications at once: 48 vs 26
  • 44 more threads: 96 vs 52
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm+ vs 14 nm
  • 5.3x more maximum memory size: 4 TB vs 768 GB
Number of cores 48 vs 26
Number of threads 96 vs 52
Manufacturing process technology 7 nm+ vs 14 nm
Maximum memory size 4 TB vs 768 GB

Reasons to consider the Intel Xeon Platinum 8170

  • Around 3% higher clock speed: 3.70 GHz vs 3.6 GHz
  • Around 45% lower typical power consumption: 165 Watt vs 240 Watt
Maximum frequency 3.70 GHz vs 3.6 GHz
Thermal Design Power (TDP) 165 Watt vs 240 Watt

Compare benchmarks

CPU 1: AMD EPYC 7643
CPU 2: Intel Xeon Platinum 8170

Name AMD EPYC 7643 Intel Xeon Platinum 8170
PassMark - Single thread mark 2695
PassMark - CPU mark 76455
Geekbench 4 - Single Core 4221
Geekbench 4 - Multi-Core 33793

Compare specifications (specs)

AMD EPYC 7643 Intel Xeon Platinum 8170

Essentials

Architecture codename Zen 3 Skylake
Launch date 15 Mar 2021 Q3'17
Launch price (MSRP) $4995
OPN PIB 100-100000326WOF
OPN Tray 100-000000326
Place in performance rating 7 1
Vertical segment Server Server
Processor Number 8170
Series Intel® Xeon® Scalable Processors
Status Launched

Performance

Base frequency 2.3 GHz 2.10 GHz
L1 cache 3 MB
L2 cache 24 MB
L3 cache 256 MB
Manufacturing process technology 7 nm+ 14 nm
Maximum frequency 3.6 GHz 3.70 GHz
Number of cores 48 26
Number of threads 96 52
Unlocked
Maximum core temperature 89°C
Number of Ultra Path Interconnect (UPI) Links 3

Memory

ECC memory support
Max memory channels 8 6
Maximum memory bandwidth 190.73 GB/s
Maximum memory size 4 TB 768 GB
Supported memory types DDR4-3200 DDR4-2666
Supported memory frequency 2666 MHz

Compatibility

Configurable TDP 225-240 Watt
Socket Count 1P/2P
Sockets supported SP3 FCLGA3647
Thermal Design Power (TDP) 240 Watt 165 Watt
Low Halogen Options Available
Package Size 76.0mm x 56.5mm

Peripherals

Max number of PCIe lanes 128 48
PCI Express revision 4.0 3.0
Scalability S8S

Advanced Technologies

AMD SenseMI
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Instruction set extensions Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units 2
Speed Shift technology

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)