AMD EPYC 7F72 vs AMD EPYC 7313P
Comparative analysis of AMD EPYC 7F72 and AMD EPYC 7313P processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD EPYC 7F72
- 8 more cores, run more applications at once: 24 vs 16
- 16 more threads: 48 vs 32
- 2.3x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
- Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 26% better performance in PassMark - CPU mark: 52597 vs 41609
Specifications (specs) | |
Number of cores | 24 vs 16 |
Number of threads | 48 vs 32 |
L1 cache | 96 KB (per core) vs 1 MB |
L2 cache | 512 KB (per core) vs 8 MB |
L3 cache | 192 MB (shared) vs 128 MB |
Benchmarks | |
PassMark - CPU mark | 52597 vs 41609 |
Reasons to consider the AMD EPYC 7313P
- CPU is newer: launch date 11 month(s) later
- Around 55% lower typical power consumption: 155 Watt vs 240 Watt
- Around 13% better performance in PassMark - Single thread mark: 2681 vs 2381
Specifications (specs) | |
Launch date | 15 Mar 2021 vs 14 Apr 2020 |
Thermal Design Power (TDP) | 155 Watt vs 240 Watt |
Benchmarks | |
PassMark - Single thread mark | 2681 vs 2381 |
Compare benchmarks
CPU 1: AMD EPYC 7F72
CPU 2: AMD EPYC 7313P
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD EPYC 7F72 | AMD EPYC 7313P |
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PassMark - Single thread mark | 2381 | 2681 |
PassMark - CPU mark | 52597 | 41609 |
Compare specifications (specs)
AMD EPYC 7F72 | AMD EPYC 7313P | |
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Essentials |
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Launch date | 14 Apr 2020 | 15 Mar 2021 |
Place in performance rating | 406 | 428 |
Architecture codename | Zen 3 | |
Launch price (MSRP) | $913 | |
OPN PIB | 100-100000339WOF | |
OPN Tray | 100-000000339 | |
Vertical segment | Server | |
Performance |
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Base frequency | 3.2 GHz | 3.0 GHz |
Die size | 74 mm² | |
L1 cache | 96 KB (per core) | 1 MB |
L2 cache | 512 KB (per core) | 8 MB |
L3 cache | 192 MB (shared) | 128 MB |
Manufacturing process technology | 7 nm | 7 nm+ |
Maximum frequency | 3.7 GHz | 3.7 GHz |
Number of cores | 24 | 16 |
Number of threads | 48 | 32 |
Transistor count | 3,800 million | |
Unlocked | ||
Memory |
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ECC memory support | ||
Supported memory types | DDR4 | DDR4-3200 |
Max memory channels | 8 | |
Maximum memory bandwidth | 190.73 GB/s | |
Maximum memory size | 4 TB | |
Compatibility |
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Max number of CPUs in a configuration | 2 | |
Sockets supported | SP3 | SP3 |
Thermal Design Power (TDP) | 240 Watt | 155 Watt |
Configurable TDP | 155-180 Watt | |
Socket Count | 1P | |
Peripherals |
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PCIe configurations | Gen 4 | |
Max number of PCIe lanes | 128 | |
PCI Express revision | 4.0 | |
Advanced Technologies |
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AMD SenseMI | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Virtualization |
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AMD Virtualization (AMD-V™) |