AMD EPYC 8224P vs Intel Xeon E3-1280 v3
Comparative analysis of AMD EPYC 8224P and Intel Xeon E3-1280 v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD EPYC 8224P
- CPU is newer: launch date 10 year(s) 3 month(s) later
- 20 more cores, run more applications at once: 24 vs 4
- 40 more threads: 48 vs 8
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 22 nm
- 6x more L1 cache, more data can be stored in the L1 cache for quick access later
- 24x more L2 cache, more data can be stored in the L2 cache for quick access later
- 8x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 5% better performance in PassMark - Single thread mark: 2367 vs 2265
- 6.1x better performance in PassMark - CPU mark: 45160 vs 7390
Specifications (specs) | |
Launch date | 18 Sep 2023 vs June 2013 |
Number of cores | 24 vs 4 |
Number of threads | 48 vs 8 |
Manufacturing process technology | 5 nm vs 22 nm |
L1 cache | 64 KB (per core) vs 64 KB (per core) |
L2 cache | 1 MB (per core) vs 256 KB (per core) |
L3 cache | 64 MB (shared) vs 8192 KB (shared) |
Benchmarks | |
PassMark - Single thread mark | 2367 vs 2265 |
PassMark - CPU mark | 45160 vs 7390 |
Reasons to consider the Intel Xeon E3-1280 v3
- Around 33% higher clock speed: 4.00 GHz vs 3 GHz
- Around 95% lower typical power consumption: 82 Watt vs 160 Watt
Maximum frequency | 4.00 GHz vs 3 GHz |
Thermal Design Power (TDP) | 82 Watt vs 160 Watt |
Compare benchmarks
CPU 1: AMD EPYC 8224P
CPU 2: Intel Xeon E3-1280 v3
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD EPYC 8224P | Intel Xeon E3-1280 v3 |
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PassMark - Single thread mark | 2367 | 2265 |
PassMark - CPU mark | 45160 | 7390 |
Geekbench 4 - Single Core | 4056 | |
Geekbench 4 - Multi-Core | 13102 |
Compare specifications (specs)
AMD EPYC 8224P | Intel Xeon E3-1280 v3 | |
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Essentials |
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Launch date | 18 Sep 2023 | June 2013 |
Launch price (MSRP) | $855 | $800 |
Place in performance rating | 509 | 432 |
Architecture codename | Haswell | |
Price now | $697.36 | |
Processor Number | E3-1280 v3 | |
Series | Intel® Xeon® Processor E3 v3 Family | |
Status | Discontinued | |
Value for money (0-100) | 4.12 | |
Vertical segment | Server | |
Performance |
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Base frequency | 2.55 GHz | 3.60 GHz |
Die size | 2x 73 mm² | 160 mm |
L1 cache | 64 KB (per core) | 64 KB (per core) |
L2 cache | 1 MB (per core) | 256 KB (per core) |
L3 cache | 64 MB (shared) | 8192 KB (shared) |
Manufacturing process technology | 5 nm | 22 nm |
Maximum case temperature (TCase) | 75°C | |
Maximum frequency | 3 GHz | 4.00 GHz |
Number of cores | 24 | 4 |
Number of threads | 48 | 8 |
Transistor count | 17,750 million | 1400 million |
Unlocked | ||
64 bit support | ||
Bus Speed | 5 GT/s DMI | |
Number of QPI Links | 0 | |
Memory |
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ECC memory support | ||
Supported memory types | DDR5 | DDR3 and DDR3L 1333/1600 at 1.5V |
Max memory channels | 2 | |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32 GB | |
Compatibility |
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Configurable TDP | 155-225 Watt | |
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | SP6 | FCLGA1150 |
Thermal Design Power (TDP) | 160 Watt | 82 Watt |
Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | |
Thermal Solution | PCG 2013D | |
Peripherals |
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PCIe configurations | Gen 5, 96 Lanes, (CPU only) | 1x16, 2x8, 1x8/2x4 |
Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | |
Scalability | 1S Only | |
Graphics |
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Processor graphics | None | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |