AMD EPYC 8224P vs Intel Xeon Gold 6250

Comparative analysis of AMD EPYC 8224P and Intel Xeon Gold 6250 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD EPYC 8224P

Intel Xeon Gold 6250

Differences

Reasons to consider the AMD EPYC 8224P

16 more cores, run more applications at once: 24 vs 8
32 more threads: 48 vs 16
A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 14 nm
Around 79% more L3 cache; more data can be stored in the L3 cache for quick access later
Around 16% lower typical power consumption: 160 Watt vs 185 Watt
Around 28% better performance in PassMark - CPU mark: 44990 vs 35164

Specifications (specs)
Number of cores	24 vs 8
Number of threads	48 vs 16
Manufacturing process technology	5 nm vs 14 nm
L3 cache	64 MB (shared) vs 35.75 MB
Thermal Design Power (TDP)	160 Watt vs 185 Watt
Benchmarks
PassMark - CPU mark	44990 vs 35164

Reasons to consider the Intel Xeon Gold 6250

Around 50% higher clock speed: 4.50 GHz vs 3 GHz
Around 14% better performance in PassMark - Single thread mark: 2705 vs 2367

Specifications (specs)
Maximum frequency	4.50 GHz vs 3 GHz
Benchmarks
PassMark - Single thread mark	2705 vs 2367

Compare benchmarks

CPU 1: AMD EPYC 8224P
CPU 2: Intel Xeon Gold 6250

PassMark - Single thread mark

CPU 1

CPU 2

2367

2705

PassMark - CPU mark

CPU 1

CPU 2

44990

35164

Name	AMD EPYC 8224P	Intel Xeon Gold 6250
PassMark - Single thread mark	2367	2705
PassMark - CPU mark	44990	35164

Compare specifications (specs)

	AMD EPYC 8224P	Intel Xeon Gold 6250
Essentials
Launch date	18 Sep 2023	Q1'20
Launch price (MSRP)	$855	$3894
Place in performance rating	510	496
Architecture codename		Cascade Lake
Processor Number		6250
Series		2nd Generation Intel Xeon Scalable Processors
Vertical segment		Server
Performance
Base frequency	2.55 GHz	3.90 GHz
Die size	2x 73 mm²
L1 cache	64 KB (per core)
L2 cache	1 MB (per core)
L3 cache	64 MB (shared)	35.75 MB
Manufacturing process technology	5 nm	14 nm
Maximum case temperature (TCase)	75°C
Maximum frequency	3 GHz	4.50 GHz
Number of cores	24	8
Number of threads	48	16
Transistor count	17,750 million
Unlocked
Maximum core temperature		60°C
Memory
ECC memory support
Supported memory types	DDR5	DDR4-2933
Max memory channels		6
Maximum memory size		1 TB
Supported memory frequency		2933 MHz
Compatibility
Configurable TDP	155-225 Watt
Max number of CPUs in a configuration	1
Sockets supported	SP6	FCLGA3647
Thermal Design Power (TDP)	160 Watt	185 Watt
Package Size		76.0mm x 56.5mm
Peripherals
PCIe configurations	Gen 5, 96 Lanes, (CPU only)
Max number of PCIe lanes		48
PCI Express revision		3.0
Scalability		S4S
Security & Reliability
Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Instruction set extensions		Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Number of AVX-512 FMA Units		2
Speed Shift technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)