AMD EPYC 8434P vs Intel Xeon E5-2651 v2

Comparative analysis of AMD EPYC 8434P and Intel Xeon E5-2651 v2 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD EPYC 8434P

Intel Xeon E5-2651 v2

Differences

Reasons to consider the AMD EPYC 8434P

CPU is newer: launch date 9 year(s) 10 month(s) later
36 more cores, run more applications at once: 48 vs 12
72 more threads: 96 vs 24
A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 22 nm
4x more L1 cache, more data can be stored in the L1 cache for quick access later
16x more L2 cache, more data can be stored in the L2 cache for quick access later
4.3x more L3 cache, more data can be stored in the L3 cache for quick access later

Launch date	18 Sep 2023 vs November 2013
Number of cores	48 vs 12
Number of threads	96 vs 24
Manufacturing process technology	5 nm vs 22 nm
L1 cache	64 KB (per core) vs 768 KB
L2 cache	1 MB (per core) vs 3 MB
L3 cache	128 MB (shared) vs 30 MB

Reasons to consider the Intel Xeon E5-2651 v2

Max number of CPUs in a configuration	2 vs 1

Compare benchmarks

CPU 1: AMD EPYC 8434P
CPU 2: Intel Xeon E5-2651 v2

Name	AMD EPYC 8434P	Intel Xeon E5-2651 v2
PassMark - Single thread mark	2448
PassMark - CPU mark	66490
Geekbench 4 - Single Core		2030
Geekbench 4 - Multi-Core		18071

Compare specifications (specs)

	AMD EPYC 8434P	Intel Xeon E5-2651 v2
Essentials
Launch date	18 Sep 2023	November 2013
Launch price (MSRP)	$2700
Place in performance rating	304	291
Architecture codename		Ivy Bridge-EP
Family		Intel Xeon E5-2600 v2
Processor Number		E5-2651 v2
Vertical segment		Server
Performance
Base frequency	2.5 GHz	1800 MHz
Die size	4x 73 mm²
L1 cache	64 KB (per core)	768 KB
L2 cache	1 MB (per core)	3 MB
L3 cache	128 MB (shared)	30 MB
Manufacturing process technology	5 nm	22 nm
Maximum case temperature (TCase)	75°C
Maximum frequency	3.1 GHz
Number of cores	48	12
Number of threads	96	24
Transistor count	35,500 million
Unlocked
64 bit support
Bus Speed		5 GT/s DMI
Memory
ECC memory support
Supported memory types	DDR5	DDR3
Max memory channels		4
Maximum memory size		768 GB (per socket)
Compatibility
Configurable TDP	155-225 Watt
Max number of CPUs in a configuration	1	2
Sockets supported	SP6	LGA2011
Thermal Design Power (TDP)	200 Watt
Peripherals
PCIe configurations	Gen 5, 96 Lanes, (CPU only)
PCI Express revision		3.0
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)