AMD EPYC 8434P vs AMD EPYC 7F52
Comparative analysis of AMD EPYC 8434P and AMD EPYC 7F52 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD EPYC 8434P
- CPU is newer: launch date 3 year(s) 5 month(s) later
- 32 more cores, run more applications at once: 48 vs 16
- 64 more threads: 96 vs 32
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 7 nm, 14 nm
- 3x more L1 cache, more data can be stored in the L1 cache for quick access later
- 6x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 20% lower typical power consumption: 200 Watt vs 240 Watt
- Around 3% better performance in PassMark - CPU mark: 66490 vs 64806
Specifications (specs) | |
Launch date | 18 Sep 2023 vs 14 Apr 2020 |
Number of cores | 48 vs 16 |
Number of threads | 96 vs 32 |
Manufacturing process technology | 5 nm vs 7 nm, 14 nm |
L1 cache | 64 KB (per core) vs 1 MB |
L2 cache | 1 MB (per core) vs 8 MB |
Thermal Design Power (TDP) | 200 Watt vs 240 Watt |
Benchmarks | |
PassMark - Single thread mark | 2448 vs 2439 |
PassMark - CPU mark | 66490 vs 64806 |
Reasons to consider the AMD EPYC 7F52
- Around 26% higher clock speed: 3.9 GHz vs 3.1 GHz
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
Maximum frequency | 3.9 GHz vs 3.1 GHz |
L3 cache | 256 MB vs 128 MB (shared) |
Compare benchmarks
CPU 1: AMD EPYC 8434P
CPU 2: AMD EPYC 7F52
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD EPYC 8434P | AMD EPYC 7F52 |
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PassMark - Single thread mark | 2448 | 2439 |
PassMark - CPU mark | 66490 | 64806 |
Compare specifications (specs)
AMD EPYC 8434P | AMD EPYC 7F52 | |
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Essentials |
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Launch date | 18 Sep 2023 | 14 Apr 2020 |
Launch price (MSRP) | $2700 | $3100 |
Place in performance rating | 252 | 266 |
Architecture codename | Zen 2 | |
OPN PIB | 100-000000140WOF | |
OPN Tray | 100-000000140 | |
Vertical segment | Server | |
Performance |
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Base frequency | 2.5 GHz | 3.5 GHz |
Die size | 4x 73 mm² | |
L1 cache | 64 KB (per core) | 1 MB |
L2 cache | 1 MB (per core) | 8 MB |
L3 cache | 128 MB (shared) | 256 MB |
Manufacturing process technology | 5 nm | 7 nm, 14 nm |
Maximum case temperature (TCase) | 75°C | |
Maximum frequency | 3.1 GHz | 3.9 GHz |
Number of cores | 48 | 16 |
Number of threads | 96 | 32 |
Transistor count | 35,500 million | |
Unlocked | ||
Memory |
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ECC memory support | ||
Supported memory types | DDR5 | DDR4-3200 |
Max memory channels | 8 | |
Maximum memory bandwidth | 190.73 GB/s | |
Maximum memory size | 4 TB | |
Compatibility |
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Configurable TDP | 155-225 Watt | |
Max number of CPUs in a configuration | 1 | |
Sockets supported | SP6 | SP3 |
Thermal Design Power (TDP) | 200 Watt | 240 Watt |
Socket Count | 1P/2P | |
Peripherals |
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PCIe configurations | Gen 5, 96 Lanes, (CPU only) | x16, x8 |
Max number of PCIe lanes | 128 | |
PCI Express revision | 4.0 | |
Advanced Technologies |
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AMD SenseMI | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Virtualization |
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AMD Virtualization (AMD-V™) |