AMD EPYC 9654P vs Intel Xeon Gold 6144

Comparative analysis of AMD EPYC 9654P and Intel Xeon Gold 6144 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD EPYC 9654P

Intel Xeon Gold 6144

Differences

Reasons to consider the AMD EPYC 9654P

88 more cores, run more applications at once: 96 vs 8
176 more threads: 192 vs 16
A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 14 nm
Around 6% better performance in PassMark - Single thread mark: 2616 vs 2461
3.8x better performance in PassMark - CPU mark: 113949 vs 30209

Specifications (specs)
Number of cores	96 vs 8
Number of threads	192 vs 16
Manufacturing process technology	5 nm vs 14 nm
Benchmarks
PassMark - Single thread mark	2616 vs 2461
PassMark - CPU mark	113949 vs 30209

Reasons to consider the Intel Xeon Gold 6144

Around 1927% higher maximum core temperature: 75°C vs 3.7 GHz
2.4x lower typical power consumption: 150 Watt vs 360 Watt

Maximum core temperature	75°C vs 3.7 GHz
Thermal Design Power (TDP)	150 Watt vs 360 Watt

Compare benchmarks

CPU 1: AMD EPYC 9654P
CPU 2: Intel Xeon Gold 6144

PassMark - Single thread mark

CPU 1

CPU 2

2616

2461

PassMark - CPU mark

CPU 1

CPU 2

113949

30209

Name	AMD EPYC 9654P	Intel Xeon Gold 6144
PassMark - Single thread mark	2616	2461
PassMark - CPU mark	113949	30209
Geekbench 4 - Single Core		4818
Geekbench 4 - Multi-Core		30845

Compare specifications (specs)

	AMD EPYC 9654P	Intel Xeon Gold 6144
Essentials
Architecture codename	Zen 4	Skylake
Launch date	10 Nov 2022	Q3'17
Launch price (MSRP)	$10625
OPN Tray	100-100000803
Place in performance rating	43	54
Processor Number		6144
Series		Intel® Xeon® Scalable Processors
Status		Launched
Vertical segment		Server
Performance
Base frequency	2.4 GHz	3.50 GHz
Die size	72 mm²
L1 cache	6 MB
L2 cache	96 MB
L3 cache	384 MB
Manufacturing process technology	5 nm	14 nm
Maximum core temperature	3.7 GHz	75°C
Number of cores	96	8
Number of threads	192	16
Transistor count	78840 million
Unlocked
Maximum frequency		4.20 GHz
Number of Ultra Path Interconnect (UPI) Links		3
Memory
ECC memory support
Max memory channels	12	6
Supported memory types	DDR5-4800	DDR4-2666
Maximum memory size		768 GB
Supported memory frequency		2666 MHz
Compatibility
Configurable TDP	320-400 Watt
Max number of CPUs in a configuration	2
Package Size	FC-LGA6096	76.0mm x 56.5mm
Sockets supported	SP5	FCLGA3647
Thermal Design Power (TDP)	360 Watt	150 Watt
Low Halogen Options Available
Peripherals
Max number of PCIe lanes	128	48
PCI Express revision	5.0	3.0
Scalability		S4S
Security & Reliability
Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Instruction set extensions		Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units		2
Speed Shift technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)