AMD EPYC Embedded 9454P vs AMD Ryzen 7 7700X
Comparative analysis of AMD EPYC Embedded 9454P and AMD Ryzen 7 7700X processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the AMD EPYC Embedded 9454P
- CPU is newer: launch date 5 month(s) later
- 40 more cores, run more applications at once: 48 vs 8
- 80 more threads: 96 vs 16
- 6x more L1 cache, more data can be stored in the L1 cache for quick access later
Launch date | 14 Mar 2023 vs 27 Sep 2022 |
Number of cores | 48 vs 8 |
Number of threads | 96 vs 16 |
L1 cache | 64K (per core) vs 512 KB |
Reasons to consider the AMD Ryzen 7 7700X
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- Around 42% higher clock speed: 5.4 GHz vs 3.8 GHz
- 174762.7x more L2 cache, more data can be stored in the L2 cache for quick access later
- 131072x more L3 cache, more data can be stored in the L3 cache for quick access later
- 2.8x lower typical power consumption: 105 Watt vs 290 Watt
Unlocked | Unlocked vs Locked |
Maximum frequency | 5.4 GHz vs 3.8 GHz |
L2 cache | 8 MB vs 1MB (per core) |
L3 cache | 32 MB vs 256MB (shared) |
Thermal Design Power (TDP) | 105 Watt vs 290 Watt |
Compare benchmarks
CPU 1: AMD EPYC Embedded 9454P
CPU 2: AMD Ryzen 7 7700X
Name | AMD EPYC Embedded 9454P | AMD Ryzen 7 7700X |
---|---|---|
PassMark - Single thread mark | 4192 | |
PassMark - CPU mark | 35855 | |
3DMark Fire Strike - Physics Score | 8904 |
Compare specifications (specs)
AMD EPYC Embedded 9454P | AMD Ryzen 7 7700X | |
---|---|---|
Essentials |
||
Launch date | 14 Mar 2023 | 27 Sep 2022 |
Place in performance rating | not rated | 199 |
Architecture codename | Zen 4 | |
Launch price (MSRP) | $399 | |
OPN Tray | 100-000000591 | |
Vertical segment | Desktop | |
Performance |
||
Base frequency | 2.75 GHz | 4.5 GHz |
Die size | 8x 72 mm² | 70 mm² |
L1 cache | 64K (per core) | 512 KB |
L2 cache | 1MB (per core) | 8 MB |
L3 cache | 256MB (shared) | 32 MB |
Manufacturing process technology | 5 nm | 5 nm |
Maximum frequency | 3.8 GHz | 5.4 GHz |
Number of cores | 48 | 8 |
Number of threads | 96 | 16 |
Transistor count | 52,560 million | 6570 million |
Unlocked | ||
Maximum case temperature (TCase) | 61 °C | |
Maximum core temperature | 100 °C | |
Memory |
||
ECC memory support | ||
Supported memory types | DDR5-4800 MHz, Twelve-channel | DDR5-5200 |
Max memory channels | 2 | |
Compatibility |
||
Configurable TDP | 240-300 Watt | |
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | SP5 | AM5 |
Thermal Design Power (TDP) | 290 Watt | 105 Watt |
Peripherals |
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PCIe configurations | Gen 5, 128 Lanes, (CPU only) | |
Max number of PCIe lanes | 24 | |
PCI Express revision | 5.0 | |
Advanced Technologies |
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Enhanced Virus Protection (EVP) | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Virtualization |
||
AMD Virtualization (AMD-V™) |