AMD Opteron 3320 EE vs Intel Xeon X5570
Comparative analysis of AMD Opteron 3320 EE and Intel Xeon X5570 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the AMD Opteron 3320 EE
- CPU is newer: launch date 16 year(s) 9 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- 3.8x lower typical power consumption: 25 Watt vs 95 Watt
| Launch date | 2012 vs March 2009 |
| Manufacturing process technology | 32 nm vs 45 nm |
| L2 cache | 4 MB vs 256 KB (per core) |
| Thermal Design Power (TDP) | 25 Watt vs 95 Watt |
Reasons to consider the Intel Xeon X5570
- 4 more threads: 8 vs 4
- Around 33% higher clock speed: 3.33 GHz vs 2.5 GHz
- Around 7% higher maximum core temperature: 75°C vs 70°C
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 87% better performance in PassMark - Single thread mark: 1445 vs 774
- 2.3x better performance in PassMark - CPU mark: 6253 vs 2675
| Specifications (specs) | |
| Number of threads | 8 vs 4 |
| Maximum frequency | 3.33 GHz vs 2.5 GHz |
| Maximum core temperature | 75°C vs 70°C |
| L1 cache | 64 KB (per core) vs 192 KB |
| Max number of CPUs in a configuration | 2 vs 1 |
| Benchmarks | |
| PassMark - Single thread mark | 1445 vs 774 |
| PassMark - CPU mark | 6253 vs 2675 |
Compare benchmarks
CPU 1: AMD Opteron 3320 EE
CPU 2: Intel Xeon X5570
| PassMark - Single thread mark |
|
|
||||
| PassMark - CPU mark |
|
|
| Name | AMD Opteron 3320 EE | Intel Xeon X5570 |
|---|---|---|
| PassMark - Single thread mark | 774 | 1445 |
| PassMark - CPU mark | 2675 | 6253 |
| Geekbench 4 - Single Core | 556 | |
| Geekbench 4 - Multi-Core | 2426 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.916 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 70.849 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.546 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 3.071 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 9.269 |
Compare specifications (specs)
| AMD Opteron 3320 EE | Intel Xeon X5570 | |
|---|---|---|
Essentials |
||
| Architecture codename | Delhi | Nehalem EP |
| Family | AMD Opteron | |
| Launch date | 2012 | March 2009 |
| OPN Tray | OS3320SJW4KHK | |
| Place in performance rating | 2539 | 2463 |
| Series | AMD Opteron 3300 Series Processor | Legacy Intel® Xeon® Processors |
| Vertical segment | Server | Server |
| Launch price (MSRP) | $49 | |
| Price now | $89 | |
| Processor Number | X5570 | |
| Status | Launched | |
| Value for money (0-100) | 18.79 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.9 GHz | 2.93 GHz |
| Die size | 315 mm | 263 mm2 |
| L1 cache | 192 KB | 64 KB (per core) |
| L2 cache | 4 MB | 256 KB (per core) |
| L3 cache | 8 MB | 8192 KB (shared) |
| Manufacturing process technology | 32 nm | 45 nm |
| Maximum core temperature | 70°C | 75°C |
| Maximum frequency | 2.5 GHz | 3.33 GHz |
| Number of cores | 4 | 4 |
| Number of threads | 4 | 8 |
| Transistor count | 1200 million | 731 million |
| Unlocked | ||
| Bus Speed | 6.4 GT/s QPI | |
| Number of QPI Links | 2 | |
| VID voltage range | 0.75V -1.35V | |
Memory |
||
| Supported memory frequency | 1400 MHz | |
| Supported memory types | DDR3 | DDR3 800/1066/1333 |
| ECC memory support | ||
| Max memory channels | 3 | |
| Maximum memory bandwidth | 32 GB/s | |
| Maximum memory size | 144 GB | |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 2 |
| Sockets supported | AM3+ | FCLGA1366 |
| Thermal Design Power (TDP) | 25 Watt | 95 Watt |
| Low Halogen Options Available | ||
| Package Size | 42.5mm x 45mm | |
Advanced Technologies |
||
| Fused Multiply-Add (FMA) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Physical Address Extensions (PAE) | 40-bit | |
Virtualization |
||
| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||