AMD Opteron 4340 vs AMD Opteron 4376 HE
Comparative analysis of AMD Opteron 4340 and AMD Opteron 4376 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization.
Differences
Reasons to consider the AMD Opteron 4340
- Around 6% higher clock speed: 3.8 GHz vs 3.6 GHz
| Maximum frequency | 3.8 GHz vs 3.6 GHz |
Reasons to consider the AMD Opteron 4376 HE
- 2 more cores, run more applications at once: 8 vs 6
- 2 more threads: 8 vs 6
- Around 0% higher maximum core temperature: 68°C vs 67.70°C
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 33% more L2 cache; more data can be stored in the L2 cache for quick access later
- Around 46% lower typical power consumption: 65 Watt vs 95 Watt
| Number of cores | 8 vs 6 |
| Number of threads | 8 vs 6 |
| Maximum core temperature | 68°C vs 67.70°C |
| L1 cache | 384 KB vs 288 KB |
| L2 cache | 8 MB vs 6 MB |
| Thermal Design Power (TDP) | 65 Watt vs 95 Watt |
Compare specifications (specs)
| AMD Opteron 4340 | AMD Opteron 4376 HE | |
|---|---|---|
Essentials |
||
| Architecture codename | Seoul | Seoul |
| Family | AMD Opteron | AMD Opteron |
| Launch date | n/d | n/d |
| OPN Tray | OS4340WLU6KHK | OS4376OFU8KHK |
| Place in performance rating | not rated | not rated |
| Series | AMD Opteron 4300 Series Processor | AMD Opteron 4300 Series Processor |
| Vertical segment | Server | Server |
Performance |
||
| 64 bit support | ||
| Base frequency | 3.5 GHz | 2.6 GHz |
| Die size | 315 mm | 315 mm |
| L1 cache | 288 KB | 384 KB |
| L2 cache | 6 MB | 8 MB |
| L3 cache | 8 MB | 8 MB |
| Manufacturing process technology | 32 nm | 32 nm |
| Maximum core temperature | 67.70°C | 68°C |
| Maximum frequency | 3.8 GHz | 3.6 GHz |
| Number of cores | 6 | 8 |
| Number of threads | 6 | 8 |
| Transistor count | 1200 million | 1200 million |
| Unlocked | ||
Memory |
||
| Supported memory frequency | 2200 MHz | 2000 MHz |
| Supported memory types | DDR3 | DDR3 |
Compatibility |
||
| Max number of CPUs in a configuration | 2 | 2 |
| Sockets supported | C32 | C32 |
| Thermal Design Power (TDP) | 95 Watt | 65 Watt |
Advanced Technologies |
||
| Fused Multiply-Add (FMA) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
Virtualization |
||
| AMD Virtualization (AMD-V™) | ||