AMD Opteron X2 275 HE vs Intel Core Duo T2600
Comparative analysis of AMD Opteron X2 275 HE and Intel Core Duo T2600 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD Opteron X2 275 HE
- Around 2% higher clock speed: 2.2 GHz vs 2.16 GHz
Maximum frequency | 2.2 GHz vs 2.16 GHz |
Max number of CPUs in a configuration | 2 vs 1 |
Reasons to consider the Intel Core Duo T2600
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 77% lower typical power consumption: 31 Watt vs 55 Watt
Manufacturing process technology | 65 nm vs 90 nm |
L2 cache | 2048 KB vs 1024 KB |
Thermal Design Power (TDP) | 31 Watt vs 55 Watt |
Compare benchmarks
CPU 1: AMD Opteron X2 275 HE
CPU 2: Intel Core Duo T2600
Name | AMD Opteron X2 275 HE | Intel Core Duo T2600 |
---|---|---|
PassMark - Single thread mark | 667 | |
PassMark - CPU mark | 460 |
Compare specifications (specs)
AMD Opteron X2 275 HE | Intel Core Duo T2600 | |
---|---|---|
Essentials |
||
Architecture codename | Italy | Yonah |
Launch date | February 2006 | 5 January 2006 |
Place in performance rating | not rated | 2757 |
Vertical segment | Server | Mobile |
Launch price (MSRP) | $440 | |
Processor Number | T2600 | |
Series | Legacy Intel® Core™ Processors | |
Status | Discontinued | |
Performance |
||
64 bit support | ||
L1 cache | 128 KB | |
L2 cache | 1024 KB | 2048 KB |
Manufacturing process technology | 90 nm | 65 nm |
Maximum frequency | 2.2 GHz | 2.16 GHz |
Number of cores | 2 | 2 |
Transistor count | 233 million | 151 million |
Base frequency | 2.16 GHz | |
Bus Speed | 667 MHz FSB | |
Die size | 90 mm2 | |
Front-side bus (FSB) | 667 MHz | |
Maximum core temperature | 100°C | |
Number of threads | 2 | |
VID voltage range | 1.1625V - 1.30V | |
Compatibility |
||
Max number of CPUs in a configuration | 2 | 1 |
Sockets supported | 940 | PPGA478, PBGA479 |
Thermal Design Power (TDP) | 55 Watt | 31 Watt |
Low Halogen Options Available | ||
Package Size | 35mm x 35mm | |
Scenario Design Power (SDP) | 0 W | |
Memory |
||
Supported memory types | DDR1 | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 32-bit | |
Virtualization |
||
Intel® Virtualization Technology (VT-x) |