AMD Phenom II 42 TWKR Black Edition vs Intel Pentium III 1133

Comparative analysis of AMD Phenom II 42 TWKR Black Edition and Intel Pentium III 1133 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD Phenom II 42 TWKR Black Edition

Intel Pentium III 1133

Differences

Reasons to consider the AMD Phenom II 42 TWKR Black Edition

CPU is newer: launch date 7 year(s) 11 month(s) later
3 more cores, run more applications at once: 4 vs 1
Around 77% higher clock speed: 2 GHz vs 1.13 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 130 nm
64x more L1 cache, more data can be stored in the L1 cache for quick access later
8x more L2 cache, more data can be stored in the L2 cache for quick access later
12.3x better performance in PassMark - CPU mark: 3489 vs 284

Specifications (specs)
Launch date	June 2009 vs July 2001
Number of cores	4 vs 1
Maximum frequency	2 GHz vs 1.13 GHz
Manufacturing process technology	45 nm vs 130 nm
L1 cache	128 KB (per core) vs 8 KB
L2 cache	512 KB (per core) vs 256 KB
Benchmarks
PassMark - CPU mark	3489 vs 284

Reasons to consider the Intel Pentium III 1133

4.3x lower typical power consumption: 29.1 Watt vs 125 Watt

Thermal Design Power (TDP)	29.1 Watt vs 125 Watt

Compare benchmarks

CPU 1: AMD Phenom II 42 TWKR Black Edition
CPU 2: Intel Pentium III 1133

PassMark - CPU mark

CPU 1

CPU 2

3489

284

Name	AMD Phenom II 42 TWKR Black Edition	Intel Pentium III 1133
PassMark - Single thread mark	0	0
PassMark - CPU mark	3489	284

Compare specifications (specs)

	AMD Phenom II 42 TWKR Black Edition	Intel Pentium III 1133
Essentials
Architecture codename	Deneb	Tualatin
Launch date	June 2009	July 2001
Place in performance rating	3314	3353
Vertical segment	Desktop	Desktop
Series		Legacy Intel® Pentium® Processor
Status		Discontinued
Performance
64 bit support
Die size	258 mm	80 mm2
L1 cache	128 KB (per core)	8 KB
L2 cache	512 KB (per core)	256 KB
L3 cache	6144 KB (shared)
Manufacturing process technology	45 nm	130 nm
Maximum frequency	2 GHz	1.13 GHz
Number of cores	4	1
Transistor count	758 million	44 million
Base frequency		1.13 GHz
Bus Speed		133 MHz FSB
Maximum case temperature (TCase)		69 °C
Maximum core temperature		69°C
VID voltage range		1.5V
Memory
Supported memory types	DDR3
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	AM3	PPGA370
Thermal Design Power (TDP)	125 Watt	29.1 Watt
Low Halogen Options Available
Advanced Technologies
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)